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Title:
TWO-PART CURING COMPOSITION SET, THERMALLY CONDUCTIVE CURED ARTICLE, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/075213
Kind Code:
A1
Abstract:
A two-part curing composition set which is equipped with: a first agent which contains an epoxy-modified organopolysiloxane A1 having an epoxy group-containing group and also contains a thermally conductive filler B1; and a second agent which contains an amino-modified organopolysiloxane A2 having an amino group-containing group and also contains a thermally conductive filler B2.

Inventors:
ONOZUKA MASAO (JP)
KUME MASASHI (JP)
Application Number:
PCT/JP2021/036402
Publication Date:
April 14, 2022
Filing Date:
October 01, 2021
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C08G59/50; C08K3/01; C08L63/00; C09K5/14; H01L23/36; H01L23/373
Domestic Patent References:
WO2019097852A12019-05-23
Foreign References:
JP2003528198A2003-09-24
CN107325782A2017-11-07
JPS60179417A1985-09-13
JPH09296114A1997-11-18
JP2011151280A2011-08-04
JPH06321518A1994-11-22
JPH10189838A1998-07-21
JPS5590554A1980-07-09
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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