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Patent Searching and Data


Title:
TWO-PART EPOXY RESIN COMPOSITION FOR FIBER-REINFORCED COMPOSITE MATERIALS, AND FIBER-REINFORCED COMPOSITE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/029743
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a two-part epoxy resin composition which, after being mixed together, gives an epoxy resin composition having excellent viscosity stability at a low temperature (40ºC) and keeps a low viscosity and has excellent infiltrating properties during being injected into reinforcing fibers, and which, after having infiltrated, moderately increases in resin viscosity to show reduced resin flow and attain, for example, a reduction in burrs in molded objects. The prepared epoxy resin composition, when molded, can be cured within a short time to give a cured object having high transparency, and can give a fiber-reinforced composite material having excellent molding quality. The present invention also addresses the problem of providing a fiber-reinforced composite material obtained using the two-part epoxy resin composition. The two-part epoxy resin composition for fiber-reinforced composite materials according to the present invention comprises components [A] to [C] as mentioned below, wherein the content of the component [C] is 6 to 25 parts by mass relative to 100 parts by mass of the component [A]. The fiber-reinforced composite material according to the present invention is obtained by combining the two-part epoxy resin composition for fiber-reinforced composite materials with reinforcing fibers and curing the combination. [A] An epoxy resin; [B] an acid anhydride; and [C] a quaternary ammonium salt, a quaternary phosphonium halide, or an imidazolium salt.

Inventors:
OKA HIDEKI (JP)
TOMIOKA NOBUYUKI (JP)
HONDA SHIRO (JP)
Application Number:
PCT/JP2016/073276
Publication Date:
February 15, 2018
Filing Date:
August 08, 2016
Export Citation:
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Assignee:
TORAY INDUSTRIES (JP)
International Classes:
C08G59/68; C08G59/42; C08J5/24
Domestic Patent References:
WO2009014270A12009-01-29
Foreign References:
JPH0218445A1990-01-22
JPS4617588B11971-05-15
JPS502100A1975-01-10
JPH11286536A1999-10-19
JP2016033197A2016-03-10
JP2013231178A2013-11-14
JPS487097U1973-01-26
Attorney, Agent or Firm:
ICHIJO, Chikara (JP)
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