Title:
TWO-STAGE REFRIGERATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2023/233937
Kind Code:
A1
Abstract:
A two-stage refrigeration apparatus 1 comprises: a low-stage side refrigeration cycle 10; a high-stage side refrigeration cycle 20; and a control device 30. The control device 30: reduces the rotational speed of a low-stage side motor 11b when the low-stage side suction pressure is lower than a first lower limit pressure; increases the rotational speed of the low-stage side motor 11b when the low-stage side suction pressure exceeds a first upper limit pressure; and maintains the rotational speed of the low-stage side motor 11b and executes control in accordance with the following low-stage side differential pressure, when the low-stage side suction pressure is not less than the first lower limit and not more than the first upper limit pressure. That is, the rotational speed of a high-stage side motor 21a is reduced when the low-stage side differential pressure is lower than a second lower limit pressure, the rotational speed of the high-stage side motor 21a is increased when the low-stage side differential pressure exceeds a second upper limit pressure, and the rotational speed of the high-stage side motor 21a is maintained when the low-stage side differential pressure is not less than the second lower limit and not more than the second upper limit pressure.
Inventors:
TSUBOI NOBORU
NAKAMURA HAJIME
SUZUKI KATSUYUKI
KANKI EIJI
NAKAMURA HAJIME
SUZUKI KATSUYUKI
KANKI EIJI
Application Number:
PCT/JP2023/017399
Publication Date:
December 07, 2023
Filing Date:
May 09, 2023
Export Citation:
Assignee:
KOBELCO COMPRESSORS CORP (JP)
International Classes:
F25B7/00; F25B1/00
Domestic Patent References:
WO2015140873A1 | 2015-09-24 |
Foreign References:
JP2013088080A | 2013-05-13 | |||
JP2013036706A | 2013-02-21 | |||
CN210512229U | 2020-05-12 | |||
JP2019525060A | 2019-09-05 | |||
JP2002364937A | 2002-12-18 | |||
JP2008249219A | 2008-10-16 |
Attorney, Agent or Firm:
YAMAO, Norihito et al. (JP)
Download PDF:
Previous Patent: SEMICONDUCTOR MODULE
Next Patent: PRESSURE-BONDING STRUCTURE OF ELECTRIC WIRE AND OUTER CONDUCTOR
Next Patent: PRESSURE-BONDING STRUCTURE OF ELECTRIC WIRE AND OUTER CONDUCTOR