Title:
ULTRA-DENSE, LOW-PROFILE EDGE CARD CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2020/051183
Kind Code:
A3
Abstract:
This present disclosure increases the interconnect density by using a different technology approach than the industry is currently using (stamping and molding). By using a MEMS-based technology approach, better geometry and impedance control can be carried out to reduce impedance discontinuities and feature size. Additional concepts include low connector insertion force, no contact wiping, and a precise alignment mechanism between the connector contacts and those on the mating substrate.
Inventors:
EPITAUX MARC (CH)
ZBINDEN ERIC (US)
CORONATI JOHN (US)
SHAH JIGNESH (US)
GORE BRANDON (US)
ZBINDEN ERIC (US)
CORONATI JOHN (US)
SHAH JIGNESH (US)
GORE BRANDON (US)
Application Number:
PCT/US2019/049458
Publication Date:
April 16, 2020
Filing Date:
September 04, 2019
Export Citation:
Assignee:
SAMTEC INC (US)
International Classes:
H01R13/6473; H01L23/367; H01L23/528; H01R12/77; H01S5/183
Foreign References:
| US5564931A | 1996-10-15 | |||
| JPS565323B2 | 1981-02-04 | |||
| US20090148108A1 | 2009-06-11 | |||
| US20130088829A1 | 2013-04-11 | |||
| US20150357736A1 | 2015-12-10 | |||
| US20140193160A1 | 2014-07-10 | |||
| US9766418B2 | 2017-09-19 | |||
| KR101269784B1 | 2013-05-30 | |||
| US6797882B1 | 2004-09-28 |
Attorney, Agent or Firm:
FORMAN, Adam, J. (US)
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