ULTRA-SMALL PAD AUXILIARY SOLDERING ELEMENT, AND MANUFACTURING ASSEMBLY, MANUFACTURING METHOD, AND AUXILIARY SOLDERING METHOD THEREOF

WIPO Patent Application WO/2019/218948

A1

Disclosed are an ultra-small PAD auxiliary soldering element, and a manufacturing assembly, a manufacturing method, and an auxiliary soldering method thereof. Ultra-small PADs are arranged on a soldering surface of an electronic component. The auxiliary soldering element comprises conductive pillars electrically connected to the PADs in one-to-one correspondence and an insulating base corresponding to the remaining area of the soldering surface. One end of a conductive pillar is inserted into the insulating base, so that the insulating base covers the end of the conductive pillar and fixes the conductive pillar, and the other end of the conductive pillar is used for being electrically connected to a transmission cable. For the present invention, the conductive pillars are used to electrically connect the transmission cable to the ultra-small PADs on the soldering surface of the electronic component, increasing the operational space during soldering, so that the soldering quality is reliable without the need of a microscope, and the false soldering or the solder dropping does not easily occur, and in addition, the present invention facilitates mass production, having a high practical value.

HUANG QIN (CN)

PCT/CN2019/086504

November 21, 2019

May 11, 2019

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HUANG QIN (CN)

H01L27/146

CN108511475A	2018-09-07
CN106646850A	2017-05-10
CN107613838A	2018-01-19
CN104685720A	2015-06-03
US20100003851A1	2010-01-07

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