TECHNICAL FIELD

The present invention describes a production method of an optical setup, comprising at least one mechanically robust freestanding ultra-thin optical element, using at least one thin film technique step and at least one mechanically robust freestanding ultra-thin optical element with an at least partly surrounding supporting frame, wherein the ultra-thin optical element is suitable for beam manipulation of visible light, infrared light and THz radiation.

STATE OF THE ART

Optical elements such as lenses are made of bulk, transparent materials. In contrast, so-called metalenses are flat surfaces etched with nanostructures that focus light like a standard lens. Similarly, flat surfaces with metallic micro- and nanostructures designed for the purpose (metasurfaces) are used to shape a light beam, e.g., into different beamlets, into a profile with flat intensity distribution, into a square beam shape, and many others. Such structures, prepared with at least one thin film technique step are defined as ultra-thin optical elements and are the aim of this invention.

Simple structures such as gratings or arrays of cross-hair elements serve as polarizers, low-pass, or bandpass wavelength filters. Metasurfaces thus are able to modulate the incoming beam (electric field) in polarization, intensity distribution (amplitude), in phase and also in propagation direction. The application range includes visible wavelengths (400 - 800 nm), and near to far-infrared wavelengths (> 0.8 pm). We focus on the state of the art in the THz regime, as the project at hand is on THz bandpass filters. Ultra-thin optical elements based on metallic micro- and nanostructures with or without substrate - such as filters, polarizers, metalenses - are commonly available. Many commercial products are fabricated from metallic foils, meshes, or wire grids. They are unprotected and are prone to damage upon handling. They are delivered in sealed containers, but, typically, the warranty is voided when the container is opened (see e.g. Tydex, ics.com)

In Opt Exp 25 (2017) 25125 an Aluminum foil with a thickness of 10 pm was laser machined, forming an ultra-thin optical element. Such unprotected freestanding metal foils are not damage tolerant and extremely difficult to handle in a laboratory and industrial environment.

There are thin-film polarizers forming ultra-thin optical elements available based on an array of metal stripes on polymer membranes, (e.g. Microtech). However, they are also not protected. The array of metal stripes is fabricated using an ultrafast laser micromachining technique. However, laser machining is limited in lateral resolution, has an insufficient structure quality, and is based on thick metal films. Other vendors deliver a pair of protective windows to sandwich the optical element, and mount it inside a metallic housing. This is making the element heavy and clumsy, (see e.g. Microtech, htto: //www. mtinstruments.com/thzDolarizers/index.htm).

Production designs for ultra-thin optical elements do exist that feature protective layers on both sides of the optical element, or stabilizing frames around it, but they are complex and expensive.

The state-of-the-art of materials for and fabrication of THz metasurfaces on polymers has recently been reviewed in Adv. Optical Mater. 8 (2020) 1900750. The state-of-the-art fabrication process (their Fig.2) consists of

(1) spin-coating PMMA on a supporting substrate (Si wafer) and dehydrating at 120 °C, subsequent

(2) direct spin-coating COC (Cyclic olefin copolymer) on the PMMA/Si wafer, before

(3) patterning and deposition of Au structures. For protecting the structure the article uses wafer bonding of a freestanding COC film obtained

(4) by the same process steps 1-2,

(5) released by dissolving the PMMA sacrificial layer and

(6) attached to a PDMS-coated Si wafer.

(7) the COC/PDMS/Si wafer is placed on the first layer Au resonators. Bonding is performed at 100 °C, a force of 400 N, and a dwelling time of 15 min using a wafer bonder. Then,

(8) the bonded COC is released by peeling off the PDMS-coated wafer. The production process is now finished or can be repeated

(9) by again patterning Au structures.

However, preparing a second COC film on a Si-wafer, releasing and transferring, and finally, wafer bonding is a complicated process. It was not possible for the authors to directly spin-coat a second COC layer onto the Au structure, as the cured COC was dissolved, causing the Au structures to displace. The resulting ultra-thin optical elements were not directly equipped with a supporting frame in the same production process.

Use of cyclic olefin copolymer for THz applications was shown for example in XP012171505, in CN115020987 as dielectric layer and in CN112635948 as dielectric film recently.

The so far known production methods of individual ultra-thin optical elements have so far been very complicated and costly, and yet a more easily prepared setup of fixed ultra-thin optical elements with a supporting frame does not exist.

DESCRIPTION OF THE INVENTION

The object of the present invention is a simplified, more cost-effective and reproducible production method of ultra-thin optical elements and setups of fixed ultra-thin optical elements, to be used for beam manipulation of visible light, infrared light and THz radiation.

The invention makes use of at least one thin film process, where the metallic functional layer is shaped into a metamaterial by lithography, and protected by sandwiching it between two polymeric layers that are transparent to radiation from UV to THz.

Additionally, a mounting frame, 3D-printed at least partly around the optical element further enhances its mechanical stability, which is produced directly after production of the multiplicity of ultra-thin optical elements. The resulting integrated compound element is thin and compact, yet robust and easy to handle.

The key elements of the invention are

(i) use of lithography for high-resolution structuring of the functional layer and creation of a metamaterial,

(ii) use of different solvents for the application of the protective polymer layers, such that the first layer is not damaged during deposition of the second one, and

(iii) direct 3D-printing of the mounting frame on the protective polymer layer using the same material class, such that the frame cannot be easily removed, e.g. by solvents and for temperature stability. Due to their wide range of wavelength from visible (400 - 800 nm) and infrared (> 0.8 pm) to THz (~1 mm), ultra-thin optical elements and setups with such ultra-thin optical elements according to the invention can be used in a vast variety of applications, either upstream a camera or photo-array to control the incoming radiation, or as filter or for beam manipulation downstream from a radiation source.

Terahertz imaging and spectroscopy are emerging and significant nondestructive evaluation (NDE) techniques used for dielectric (nonconducting) materials analysis and quality control in the pharmaceutical, biomedical, security, materials characterization, and aerospace industries.

Applications in the visible and infrared range are mainly focused on laboratory use, like microscopy, but could be extended to wider markets like lighting of cars or other mobile illumination with restrictions on device space and weight.

DESCRIPTION

We present here production of ultra-thin optical elements with a supporting frame, building a setup with at least one ultra-thin, mechanically robust optical elements for beam manipulation like, among others, lenses, filters and polarizers, with freestanding geometry, mountable directly to standard optics holders and suitable for visible light (wavelength 400-800 nm), infrared (> 0.8 pm) and Terahertz radiation (~1 mm).

The production method we have developed aims at fabricating freestanding ultra-thin optical elements for beam manipulation that can directly be mounted to standard optics holders.

It encompasses the entire process from the design and substrate preparation to the final product, a setup with at least one ultra-thin optical element, and the supporting frame.

The essential advantage of the process is that the steps from the substrate preparation to the final, mountable element are done on a single carrier without the need of transfer or wafer bonding.

Any design of the metallic structure(s) can be produced, limited only by the processing capability of steps B) and C) below. We have demonstrated the process for band-pass filters centred in the range from 0.3 THz to 3 THz. The process, however, is not limited to the THz range. All materials and processes involved are compatible for the frequency range from UV (<300 nm) to THz (mm-waves).

The process is described as follows.

A) A rigid carrier is coated with a thin separation layer and a polymer substrate using spin-coating.

The thickness of the polymer substrate is adjusted by choosing the appropriate processing parameters. We have demonstrated the process using a) a silicon wafer (4" Si-Wafer) as a carrier; b) Poly(methyl methacrylate) (PMMA) as a separation layer, or (Poly(4-vinylphenol), also called polyvinylphenol or PVP, or Poly(vinyl alcohol) (P A) can be used, most preferably applied by spin-coating, with thicknesses from 0.5 pm up to 5 pm; c) a substrate of Cyclic olefin copolymer (COC, transparent amorphous polymer) with a first solvent 1,2 Dimethylcyclohexan, resulting in thicknesses between 1 pm and 25 pm of COC, most preferred by spin-coating, and subsequent curing.

B) A photoresist layer is applied to the substrate/separation/carrier system and exposed according to the design of the metasurface for later metallization. We have demonstrated the process by spin-coating a photoresist layer and laser beam writing. The photoresist layer is compatible with photolithography or e-beam writing for patterning.

As an example, photoresist AZ 5214E was used resulting in a thickness between 1pm to 2pm.

C) The photoresist layer/substrate/separation/carrier-system is subsequently metallized and later lift-off of the mask is performed. We have demonstrated the coating process by thermal deposition of chrome (5 nm thickness) and of gold (200 nm thickness) and later liftoff in cold acetone.

However, the process is not limited to gold, because COC is compatible with any metal.

D) After the fabrication of the at least one optical element - comprising so far the carrier, separation layer, polymer substrate, photoresist layer, structured metal layer - an additional protective layer is applied if needed.

We have demonstrated the protective layer coating process by spincoating another layer of COC with a second solvent, here Buthylbenzene, onto the structured metal layer, with thickness of the resulting protective layer greater than 1 pm. This protective layer is based on a different second solvent than the first solvent used in step A, so the polymer substrate as first COC layer is not dissolved, and the gold structures of the metal layer are not displaced.

E) Finally, as a reinforcing structure, a supporting frame or mounting frame of appropriate dimensions is directly applied on the top while still on the carrier to later individuate the optical elements. We have demonstrated the process using 3D printing of the supporting frame of a thermoplastic like COC directly onto the protective layer.

The 3D printed supporting frames are strongly bonded to the films and cannot be removed with solvents, such as acetone. In addition, using COC for 3D printing eliminates effects such as corrugation due to different coefficients of thermal expansion, which makes the resulting component more robust.

The 3D printed supporting frames are not printed onto the polymer substrate, but directly onto the protective layer while on the carrier. Depending on the 3D printing, a multiplicity of optical elements can be grouped into setups comprising a multiplicity of optical elements. The frame dimension is adapted to the later mounting option, such as a standard lens or filter mount, but can also be designed to an individual geometry adapted to a special use.

F) Each whole optical element, comprising polymer substrate with the structured metal layer and protective layer is subsequently removed from the carrier by dissolving the separation layer, in our case the PMMA layer using acetone. This dissolving procedure must be carried out after the 3D printing and secures that the optical elements e.g. in the form of filters remain flat, protected and directly mountable.

G) The individual optical elements supported by the supporting frame are obtained after removal from the carrier by cutting. The cutting can be done by known macroscopic tools. The optical elements are ready to be used as freestanding optical elements and/or as optical elements mountable in dedicated or standard optomechanical holders such as lens holders, filter holders, mounting barrels, or others.

Cyclic olefin copolymer mentioned above includes compounds comprising an amount of cyclic olefin copolymer, and comprising other transparent polymers.

LIST OF PARTS setup of fixed ultra-thin optical elements ultra-thin optical element (standalone, a passive photonic device) carrier separation layer (PMMA) polymer substrate (with first solvent, Cyclic olefin copolymer, COC, tradename TOPAS, > 1 pm) photoresist layer (AZ 5214E, (2000 R.PM/20 s to 4000R.PM/ 20 s) most preferred spin-coating) metal layer (metallic functional layer, 5 nm chrome, 200 nm gold) protective layer (COC with the second solvent) supporting frame/mounting frame (for ultra-thin optical elements, integrated as part of the setup, 3D printed)