Title:
ULTRA-THIN SOLDERING GASKET AND PREPARATION METHOD THEREFOR, SOLDERING METHOD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/127748
Kind Code:
A1
Abstract:
Embodiments of the present invention relate to the field of soldering sheets, and provided therein are an ultra-thin soldering gasket and a preparation method therefor, a soldering method, and a semiconductor device. The ultra-thin soldering gasket comprises: an internal support structure and a solder layer which covers a surface of the internal support structure, the solder layer being formed by uniformly attaching a solder liquid to the surface of the internal support structure. The preparation method for an ultra-thin soldering gasket comprises the following steps: immersing an internal support structure that has passed through a surface treatment process into a solder liquid, then removing same, and cooling. The soldering method based on the ultra-thin soldering gasket comprises: placing an ultra-thin soldering gasket between soldering surfaces to be soldered, and then performing reflux soldering to form a semiconductor device. The ultra-thin soldering gasket is flat and is not warped, solders are uniform, the minimum thickness of a single layer is only five micrometers, and high-accuracy soldering requirements can be met.
Inventors:
HUA FAY (CN)
YAGHMAZADEH MINA (CN)
YAGHMAZADEH MINA (CN)
Application Number:
PCT/CN2021/137559
Publication Date:
June 23, 2022
Filing Date:
December 13, 2021
Export Citation:
Assignee:
NINGBO S J ELECTRONICS CO LTD (CN)
International Classes:
B23K35/20; B23K3/00
Foreign References:
| CN112605486A | 2021-04-06 | |||
| CN107486651A | 2017-12-19 | |||
| CN106825999A | 2017-06-13 | |||
| CN108453414A | 2018-08-28 | |||
| CN104625461A | 2015-05-20 | |||
| CN109848611A | 2019-06-07 | |||
| CN111020443A | 2020-04-17 | |||
| CN105537793A | 2016-05-04 | |||
| JPS53100152A | 1978-09-01 |
Attorney, Agent or Firm:
CHOFN INTELLECTUAL PROPERTY (CN)
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