Title:
ULTRA WIDEBAND BOARD-TO-BOARD TRANSITIONS FOR STRIPLINE RF TRANSMISISON LINES
Document Type and Number:
WIPO Patent Application WO/2023/133750
Kind Code:
A1
Abstract:
RF transmission lines include a first printed circuit board that includes a first stripline transmission line and a first non-stripline transmission line that is electrically connected to the first stripline transmission line, a second printed circuit board that includes a second stripline transmission line and a second non-stripline transmission line that is electrically connected to the second stripline transmission line, a metal signal trace connector that electrically connects a first signal trace of the first non-stripline transmission line to a second signal trace of the second non-stripline transmission line, and an RF shielding cover that covers the metal signal trace connector.
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| JP6665759 | High frequency circuit |
Inventors:
LYU FUSHENG (CN)
WU LIGANG (CN)
HE FAN (CN)
ZHANG ZHANMING (CN)
WU LIGANG (CN)
HE FAN (CN)
ZHANG ZHANMING (CN)
Application Number:
PCT/CN2022/071729
Publication Date:
July 20, 2023
Filing Date:
January 13, 2022
Export Citation:
Assignee:
COMMSCOPE TECHNOLOGIES LLC (US)
LYU FUSHENG (CN)
LYU FUSHENG (CN)
International Classes:
H01P1/04; H01P5/08
Foreign References:
| US20100254094A1 | 2010-10-07 | |||
| JPH11346106A | 1999-12-14 | |||
| EP3229311A1 | 2017-10-11 |
Other References:
YANG SHILIN ET AL: "A Low-Loss Broadband Planar Transition From Ground Coplanar Waveguide to Substrate-Integrated Coaxial Line", IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, IEEE SERVICE CENTER, NEW YORK, NY, US, vol. 31, no. 11, 12 May 2021 (2021-05-12), pages 1191 - 1194, XP011886883, ISSN: 1531-1309, [retrieved on 20211104], DOI: 10.1109/LMWC.2021.3079439
JIANG C ET AL: "Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations", MICROWAVE CONFERENCE, 2009. EUMC 2009. EUROPEAN, IEEE, PISCATAWAY, NJ, USA, 29 September 2009 (2009-09-29), pages 1369 - 1372, XP031669925, ISBN: 978-1-4244-4748-0
JIANG C ET AL: "Packaging of photodetector modules for 100 Gbit/s applications using electromagnetic simulations", MICROWAVE CONFERENCE, 2009. EUMC 2009. EUROPEAN, IEEE, PISCATAWAY, NJ, USA, 29 September 2009 (2009-09-29), pages 1369 - 1372, XP031669925, ISBN: 978-1-4244-4748-0
Attorney, Agent or Firm:
CCPIT PATENT AND TRADEMARK LAW OFFICE (CN)
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