Title:
ULTRASONIC CLEANING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/026422
Kind Code:
A1
Abstract:
This ultrasonic cleaning method comprises: a cleaning solution application step (S101) in which a cleaning solution is applied to the surface of an electronic component retained on a cleaning stage; a removal step (S103) in which ultrasonic waves are radiated from an ultrasonic speaker attached to an acoustic head onto the surface of the electronic component to which the cleaning solution has been applied, and a foreign substance stuck to the surface is removed from the surface; and a suction step (S104) in which the ultrasonic waves generated by the ultrasonic speaker are concentrated in a gap between a casing and a retaining surface of the cleaning stage to form, below the center of the casing, a low-pressure region having lower pressure than the atmosphere, and the foreign substance removed from the surface of the electronic component and the cleaning solution applied to the surface are sucked into the low-pressure region.
Inventors:
KIRKBY MICHAEL (JP)
LANDAEZ GARCIA YSMALDO JOSE (JP)
MUNAKATA HIROSHI (JP)
LANDAEZ GARCIA YSMALDO JOSE (JP)
MUNAKATA HIROSHI (JP)
Application Number:
PCT/JP2021/031274
Publication Date:
March 02, 2023
Filing Date:
August 26, 2021
Export Citation:
Assignee:
YAMAHA ROBOTICS HOLDINGS CO LTD (JP)
International Classes:
H01L21/304
Foreign References:
| JP2016077936A | 2016-05-16 | |||
| JPH07201799A | 1995-08-04 | |||
| JP2017506157A | 2017-03-02 | |||
| JP2019153638A | 2019-09-12 |
Attorney, Agent or Firm:
YKI INTELLECTUAL PROPERTY ATTORNEYS (JP)
Download PDF: