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Title:
ULTRASONIC PROBE AND METHOD FOR MANUFACTURING ULTRASONIC PROBE
Document Type and Number:
WIPO Patent Application WO/2018/070159
Kind Code:
A1
Abstract:
Provided are an ultrasonic probe having a highly-sensitive piezoelectric element and a method for manufacturing the ultrasonic probe. This ultrasonic probe is obtained by arranging a plurality of piezoelectric elements in an array-like manner in a direction in which the plurality of piezoelectric elements are arranged on a backing material, wherein: the plurality of piezoelectric elements each comprise a stacked body obtained by sequentially stacking, on the surface of the backing material, a first conductive part, a piezoelectric substance part, and a second conductive part; the ultrasonic probe has a plurality of acoustic matching parts that are disposed on the respective second conductive parts of the plurality of piezoelectric elements; the ultrasonic probe includes a plurality of third conductive parts in which portions in the elevation direction of the plurality of acoustic matching parts are joined on the second conductive parts; the ultrasonic probe has fourth conductive parts for electrically connecting the third conductive parts; and the second conductive parts of the plurality of piezoelectric elements, and the plurality of third conductive parts and the fourth conductive parts form one common electrode that is common to the plurality of piezoelectric elements.

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Inventors:
OSAWA ATSUSHI (JP)
Application Number:
PCT/JP2017/032679
Publication Date:
April 19, 2018
Filing Date:
September 11, 2017
Export Citation:
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Assignee:
FUJIFILM CORP (JP)
International Classes:
H04R17/00; A61B8/14; H04R31/00
Foreign References:
JP2007036642A2007-02-08
JP2003230194A2003-08-15
JP2009152785A2009-07-09
JPH03162839A1991-07-12
JPH09215095A1997-08-15
Other References:
See also references of EP 3528511A4
Attorney, Agent or Firm:
WATANABE Mochitoshi et al. (JP)
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