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Patent Searching and Data


Title:
ULTRASONIC SENSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/159678
Kind Code:
A1
Abstract:
Disclosed is an ultrasonic sensing device adapted to be arranged below a flat panel layer (20) of a terminal device. The ultrasonic sensing device comprises a supporting layer (120) and a piezoelectric layer (130). The supporting layer (120) comprises cavities (121-124). The piezoelectric layer (130) is formed above the supporting layer (120) or below a substrate (110). The piezoelectric layer (130) emits planar ultrasonic waves towards the flat panel layer (20) to a finger located above the flat panel layer (20), and the finger reflects the acoustic waves. The reflected acoustic waves pass through the piezoelectric layer (130) to the supporting layer (120), such that the cavities (121-124) receive the reflected acoustic waves. Therefore, the ultrasonic sensing device can obtain an ultrasonic sensing image with good image contrast.

Inventors:
WANG DI-BAO (CN)
FAN CHEN-CHIH (CN)
Application Number:
PCT/CN2020/108891
Publication Date:
August 19, 2021
Filing Date:
August 13, 2020
Export Citation:
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Assignee:
EGIS TECH INC (CN)
International Classes:
G10K9/122; G06K9/20; G10K11/28; H01L41/083
Foreign References:
CN209531368U2019-10-25
CN108960218A2018-12-07
CN207780806U2018-08-28
CN106711320A2017-05-24
CN110265544A2019-09-20
US20170322292A12017-11-09
Attorney, Agent or Firm:
LEADER PATENT & TRADEMARK FIRM (CN)
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