ULTRASONIC SENSOR AND MANUFACTURING METHOD THEREFOR

WIPO Patent Application WO/2016/002206

A1

Provided is an ultrasonic sensor which achieves a reduction in impedance without deteriorating the characteristics of elements and an improvement in reliability by efficiently drawing out a wire from the elements arranged in an array. An ultrasonic sensor (1) is provided with a plurality of ultrasonic elements (10) arranged in a first direction and a second direction and each provided with a first electrode (14), a piezoelectric layer (15), and a second electrode (16), and is characterized in that at least some of the plurality of ultrasonic elements are divided into groups, the first electrode (14) and/or the second electrode (16) is shared by the ultrasonic elements (10) of each of the groups, a bypass wire (21) is connected to one of the shared first electrode (14) and second electrode (16), the following α value of the bypass wire (21) is larger than the α value of the first electrode (14) or the second electrode (16) connected to the bypass wire (21), and the electric resistance value per unit length of the bypass wire (21) is smaller than that of the first electrode (14) or the second electrode (16). α value = (Young's modulus of constituent material) × (cross-sectional area of wire or electrode)

KOJIMA CHIKARA (JP)

PCT/JP2015/003281

January 07, 2016

June 30, 2015

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SEIKO EPSON CORP (JP)

H04R17/00; A61B8/00; H01L41/047; H01L41/113; H01L41/29; H04R31/00

JP2011082624A	2011-04-21
JP2012109800A	2012-06-07
JP2014017564A	2014-01-30
JP2013106188A	2013-05-30

WATANABE, Kazuaki et al. (JP)
Kazuaki Watanabe (JP)

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