Title:
ULTRASONIC SOLDERING DEVICE AND ULTRASONIC SOLDERING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/129410
Kind Code:
A1
Abstract:
[Purpose] The present invention relates to an ultrasonic soldering device and an ultrasonic soldering method, and the purpose of the present invention is to form a uniform, thin, and robust solder layer without thermal damage and ultrasonic damage to a film of a substrate. [Configuration] Provided is an ultrasonic soldering device characterized by comprising a bit heating device, an ultrasonic oscillation device, a solder preliminary heating device, a solder slide device, and a bit moving device, and characterized in that preliminarily heated, string-shaped solder is melted with a bit part, ultrasonic is applied thereto, an adhesion of a close substrate part is removed, and melted solder is adhered to the substrate part to perform soldering.
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| JP2515128 | [Title of Invention] Soldering Robot |
Inventors:
ARAI KATSUYA (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
SUGAWARA MIEKO (JP)
KOBAYASHI KENICHI (JP)
KOMIYA HIDETOSHI (JP)
MATSUI SHOGO (JP)
NISHIGORI JUN (JP)
Application Number:
PCT/JP2019/042073
Publication Date:
June 25, 2020
Filing Date:
October 25, 2019
Export Citation:
Assignee:
ARTBEAM CO LTD (JP)
International Classes:
B23K3/00; B23K3/02; H01L31/05
Foreign References:
| JP2012074565A | 2012-04-12 | |||
| JP2012016744A | 2012-01-26 | |||
| JP2009195939A | 2009-09-03 | |||
| JP2001102610A | 2001-04-13 |
Attorney, Agent or Firm:
OKADA Morihiro (JP)
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