Title:
ULTRASONIC TRANSDUCER AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2022/168188
Kind Code:
A1
Abstract:
This ultrasonic transducer comprises: a support board that has a plurality of recesses opened in a first surface and a plurality of waveguides opened in a second surface; a flexible resin film that is fixed to the support board; and a plurality of piezoelectric elements that are fixed to the flexible resin film such that in planar view, center regions thereof overlap with the recesses and peripheral regions thereof overlap with the support board. Vibrating bodies that are formed by the piezoelectric elements and the flexible resin film are configured such that the frequency of the lowest-order resonance mode of flexural vibration thereof is higher than the driving frequency of the piezoelectric elements. The support board is configured such that the frequency of the lowest-order resonance mode of flexural vibration of the ultrasonic transducer overall is higher than the driving frequency of the piezoelectric elements.
Inventors:
TAKASUGI SATORU (JP)
Application Number:
PCT/JP2021/003816
Publication Date:
August 11, 2022
Filing Date:
February 03, 2021
Export Citation:
Assignee:
SUNCALL CORP (JP)
International Classes:
H04R17/00; H04R29/00
Foreign References:
| JP6776481B1 | 2020-10-28 | |||
| JP2020115940A | 2020-08-06 |
Attorney, Agent or Firm:
ARAWORE INTERNATIONAL IP LAW FIRM (JP)
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