ULTRATHIN COPPER FOIL WITH CARRIER, AND COPPER LAMINATED BOARD OR PRINTED WIRING BOARD

WIPO Patent Application WO/2010/027052

A1

Disclosed is an ultrathin copper foil with carrier that suppresses blistering and stabilizes peeling strength, specifically an ultrathin copper foil with carrier in which the carrier foil and ultrathin copper foil can be easily peeled apart, even when placed in a high-temperature environment. As a means of accomplishing this, the ultrathin copper foil with carrier comprises a carrier foil, a peeling layer, and a copper foil, wherein which the peeling layer is made from a first peeling layer that is disposed on the side of the carrier foil and a second peeling layer disposed on the side of an electrolytic copper foil, there is a first interface between the carrier foil and the first peeling layer, a second interface between the ultrathin copper foil and the second peeling layer, and a third interface between the first peeling layer and the second peeling layer, and the peeling strength at the interfaces is such that first interface > third interface and second interface > third interface.

UNO TAKEO (JP)
KAWAKAMI AKIRA (JP)
SUZUKI YUJI (JP)

PCT/JP2009/065511

March 11, 2010

September 04, 2009

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FURUKAWA ELECTRIC CO LTD (JP)
UNO TAKEO (JP)
KAWAKAMI AKIRA (JP)
SUZUKI YUJI (JP)

B32B15/01; C25D7/06; B32B15/08; C25D1/20; H05K3/00

WO2002024444A1

2002-03-28

JP2004169181A	2004-06-17
JP2005502496A	2005-01-27
JP2007186781A	2007-07-26
JP2007186782A	2007-07-26
JP2001301087A	2001-10-30
JP2002368365A	2002-12-20
JP2003011267A	2003-01-15
JP2008130867A	2008-06-05
JP2007186781A	2007-07-26
JP2007186782A	2007-07-26

SATOH, TAKAHISA (JP)
Takahisa Sato (JP)

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