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Title:
ULTRAVIOLET-CURABLE PRESSURE-SENSITIVE SILICONE ADHESIVE COMPOSITION AND CURED OBJECT OBTAINED THEREFROM
Document Type and Number:
WIPO Patent Application WO/2020/121735
Kind Code:
A1
Abstract:
An ultraviolet-curable pressure-sensitive silicone adhesive composition which comprises (A) an organopolysiloxane of formula (1) (R1 represents a polymerizable group or a monovalent hydrocarbon group and at least one of the R1 moieties is a polymerizable group, R2 represents an oxygen atom or an alkylene group, and m and n indicate numbers satisfying m≥0, n≥1, and 1≤(m+n)≤1,000), (B) an organopolysiloxane resin comprising (a) R3 3SiO1/2 units (R3 represents a monovalent hydrocarbon group) and (b) SiO4/2 units, the molar ratio of the (a) units to the (b) units being (0.6-1.2):1, (C) a compound having at least one group of formula (2) in the molecule (R4 represents a hydrogen atom or a methyl group, R5 represents a hydrogen atom or a monovalent hydrocarbon group, a is an integer of 1-5, and * indicates the site of bonding to an adjoining atom), and (D) a photopolymerization initiator. The ultraviolet-curable pressure-sensitive silicone adhesive composition has satisfactory curability and gives cured objects which, as temporary fixers, have excellent tackiness and strength.

Inventors:
KITAGAWA TAICHI (JP)
OTAKE KOHEI (JP)
MATSUMOTO NOBUAKI (JP)
HATTORI HATSUHIKO (JP)
Application Number:
PCT/JP2019/044828
Publication Date:
June 18, 2020
Filing Date:
November 15, 2019
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
International Classes:
C09J183/07; C08F2/50; C08F290/06; C09J4/02; C09J7/38; C09J11/06; C09J183/04
Domestic Patent References:
WO2016060084A12016-04-21
WO2019065398A12019-04-04
Foreign References:
JP2004155832A2004-06-03
JPH0931332A1997-02-04
JP2008031307A2008-02-14
Other References:
FENG, X. ET AL.: "Competing fracture in kinetically controlled transfer printing", LANGMUIR, vol. 23, no. 25, 2007, pages 12555 - 12560, XP055716752
Attorney, Agent or Firm:
PATENT PROFESSIONAL CORPORATION EI-MEI PATENT OFFICE (JP)
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