Title:
UNDERCUT PROCESSING MECHANISM, MOLDING DIE, AND MOLDED ARTICLE
Document Type and Number:
WIPO Patent Application WO/2020/174615
Kind Code:
A1
Abstract:
Provided are a compact undercut processing mechanism whereby a molded article can be easily released even when the molded article has a portion that protrudes in the direction in which an undercut part is removed, a molding die, and a molded article. The present invention provides an undercut processing mechanism 11 used while attached to a fixed mold or movable mold of a molding die for molding a molded article having an undercut part, the undercut processing mechanism 11 being provided with: a sliding piece 50 provided with a molding core 80 for molding the undercut part, the sliding piece 50 linking to a retaining piece 30 and advancing and retreating; a holder 20 provided with a guide means for guiding the sliding piece 50 so that the molding core 80 separates from the undercut part; a retaining piece 30 guided by the holder 20, the retaining piece 30 linking to an ejector mechanism and advancing and retreating; and a connecting means for slidably connecting the retaining piece 30 and the sliding piece 50; the connecting means being provided with a separation mechanism for disconnecting the retaining piece 30 and the sliding piece 50 when the sliding piece 50 moves to a prescribed position.
Inventors:
SORIMOTO MASANORI (JP)
Application Number:
PCT/JP2019/007593
Publication Date:
September 03, 2020
Filing Date:
February 27, 2019
Export Citation:
Assignee:
TECHNOCRATS CORP (JP)
International Classes:
B29C33/44
Domestic Patent References:
| WO2018193502A1 | 2018-10-25 |
Foreign References:
| JP2007176047A | 2007-07-12 |
Attorney, Agent or Firm:
SENTOKUIN,Hiroshi (JP)
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