Title:
UNDERFILL MATERIAL, AND PREPARATION METHOD THEREFOR AND USE THEREOF
Document Type and Number:
WIPO Patent Application WO/2023/109165
Kind Code:
A1
Abstract:
The present invention belongs to the field of underfill materials for chips, and relates to a high-Tg reworkable underfill material capable of realizing rapid filling at room temperature, and a preparation method therefor and the use thereof. The underfill material comprises an epoxy resin, a thiol compound and a catalyst, wherein the epoxy resin has a structure as shown in formula (1); and the equivalence ratio of a sulfydryl of the thiol compound to an epoxy group of the epoxy resin is 0.01-0.5. In the present invention, the thiol compound is used as a curing agent for the epoxy resin underfill material, an epoxy resin with a specific structure is selected and used, and the equivalence ratio of the sulfydryl of the thiol compound to the epoxy group of the epoxy resin is controlled to be at 0.01-0.5, such that the thiol compound can be used in an epoxy resin underfill material system; moreover, the purposes of a high Tg, rapid filling at room temperature, rapid curing, and reworkability at a high temperature are ensured.
Inventors:
LIN HONGTENG (CN)
LIU TAO (CN)
LI SHUAI (CN)
LIU TAO (CN)
LI SHUAI (CN)
Application Number:
PCT/CN2022/113627
Publication Date:
June 22, 2023
Filing Date:
August 19, 2022
Export Citation:
Assignee:
WELDTONE TECH CO LTD (CN)
International Classes:
C08G59/68; C08G59/66; C08K3/36; C08L63/00
Domestic Patent References:
| WO2020111244A1 | 2020-06-04 |
Foreign References:
| CN114057995A | 2022-02-18 | |||
| CN101479311A | 2009-07-08 | |||
| CN109232861A | 2019-01-18 | |||
| CN108299623A | 2018-07-20 | |||
| JP2014031461A | 2014-02-20 | |||
| CN108192082A | 2018-06-22 | |||
| CN104774584A | 2015-07-15 | |||
| CN108440740A | 2018-08-24 |
Attorney, Agent or Firm:
XIAMEN LIXINLVHE INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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