Title:
UNDERFILL RESIN HAVING STABLE ADHESIVENESS UNDER HIGH TEMPERATURE AND PREPARATION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/248724
Kind Code:
A1
Abstract:
An underfill resin having stable adhesiveness under high temperature and preparation method therefor, comprising 20~60 parts by mass of epoxy resin, 5~30 parts by mass of curing agent, 0.1~5 parts by mass of solid or liquid latent curing accelerator, 40~80 parts by mass of inorganic filler, 0.3~10 parts by mass of organic modified bentonite, and 0~5 parts by mass of colorant where needed. Since the latent curing accelerator and the organic modified bentonite are simultaneously adopted, adhesiveness of the underfill resin obtained does not weaken with rising temperature, and adhesiveness is kept stable under high temperature.
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Inventors:
WU DE (CN)
LIAO SHUHANG (CN)
WANG YI (CN)
SU JUNXING (CN)
LIAO SHUHANG (CN)
WANG YI (CN)
SU JUNXING (CN)
Application Number:
PCT/CN2020/114545
Publication Date:
December 16, 2021
Filing Date:
September 10, 2020
Export Citation:
Assignee:
WUHAN CHOICE TECH CO LTD (CN)
International Classes:
C09J163/00; C08G59/68; C09J11/04; C09J11/06; C09J163/02
Foreign References:
| CN111518499A | 2020-08-11 | |||
| CN111117540A | 2020-05-08 | |||
| CN104232014A | 2014-12-24 | |||
| CN104817989A | 2015-08-05 | |||
| US20120193817A1 | 2012-08-02 |
Other References:
HE SUMIN: "One Fast Flow of Low Temperature Curing Adhesive Underfill", CHINA MASTER'S THESES FULL-TEXT DATABASE, INFORMATION TECHNOLOGY, no. S2, 15 December 2011 (2011-12-15), XP055878741
Attorney, Agent or Firm:
WUHAN SINOPOWER PATENT AGENCY (CN)
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