FIELD OF THE INVENTION

[0001] The embodiments of the present disclosure relate generally to power electronics and particularly to electronic printed circuit board.

BACKGROUND OF THE INVENTION

[0002] In recent years, with the automobile industry growing rapidly, the electronic devices that are mounted on automobiles have increased significantly. Most of these electronic devices include printed circuit board assemblies. A printed circuit board (PCB) includes an insulated substrate that supports electrical components that are interconnected using conductive pathways. The printed circuit boards have been used for various reasons and one of the main usages is for Battery Management System (BMS). The Battery Management System (BMS) is the main energy source in a vehicle. The BMS provides a conductive path for flow of high current from the battery pack to load circuits. The high current or high voltage drawn from the battery pack is delivered to load and managed by the BMS. The BMS for lithium-ion battery pack generally performs the functions such as voltage monitoring, current monitoring, temperature monitoring, state of charge (SOC) and state of health (SOH) calculation. The BMS also interrupts the flow of high current to the load in case any fault is detected.

[0003] In conventional systems, the rigid and conductive bus bars on the PCB for BMS cannot carry high current through the circuit because of its rigid structure and high conductivity. As the demand for power in the PCB increases, it causes increased resistance to current flow and generation of an excessive amount of heat. The BMS which is implemented on a FR4 (fiber reinforced) substrate board cannot carry high current without implementing the present disclosure. Incase the high current is passed through the PCB available in the present art, the entire circuit will burn.

[0004] In the present art, BMS PCB has a limitation on copper thickness that can be implemented on a FR4 PCB in order to carry high current due to difficulty in fabrication and assembly. For the existing PCB, when the high current is provided as an input, it results in burning of the circuit. In case the copper thickness of a FR4 PCB is increased to carry high current, it results in a PCB structure that occupies more space and also involves higher fabrication cost. The existing interface for entry and exit of high current through the PCB is challenging as they require soldering.

PROBLEM TO BE SOLVED BY INVENTION

[0005] Hence, it is a primary objective of the current invention to prevent burning of the circuit when high current is provided as an input through the PCB. It is imperative to provide an architecture on the PCB for BMS that allows carrying of high current efficiently.

[0006] Thus, it is another objective of the current invention to avoid increasing of copper thickness to carry high current as it occupies more space on the PCB and involves higher cost.

[0007] Thus, it is yet another objective of the current invention to avoid soldering in order to provide the interface for entry and exit of high current through the PCB. Because soldering on the PCB leads to high resistivity and less conductivity.

[0008] The above-mentioned shortcomings, disadvantages and problems are addressed herein and which will be understood by reading and studying the following specification. SUMMARY OF THE INVENTION

[0009] According to an embodiment of the invention, the high current from the source is provided as an input to the entry press fit terminals. The entry press fit terminals interface the source to the PCB for passing of high current. The entry press fit terminals further transfer the received high current to the inner layers of the PCB. The entry bus bar receives the high current transferred by the entry press fit terminals and distributes the high current to dissipate heat for thermal management. The switch elements are configured to pass or interrupt the flow of distributed high current that is received from the entry bus bar. The exit bus bar further distributes the high current passed from the switch elements. The exit press fit terminals receive the distributed high current from the exit bus bar, wherein the received high current is transferred to the load.

[0010] As per first embodiment of the current invention, the system comprises of a first link-element for connecting the plurality of entry press-fit terminals.

[0011] As per second embodiment of the current invention, the system comprises of a second link-element for connecting the plurality of exit press-fit terminals.

[0012] As per third embodiment of the current invention, the system comprises of the entry bus bar and the exit bus bar which may be made of copper, aluminium, electrically conductive materials.

[0013] As per fourth embodiment of the current invention, the system comprises of the first link-element and the second link-element which may be made of copper, aluminium, electrically conductive materials.

[0014] As per fifth embodiment of the current invention, the system comprises of the plurality of switch elements which may be semiconductor switches, mechanical switches or electro-mechanical switches. [0015] According to an embodiment of the invention, a method for passing high current through a printed circuit board (PCB) is disclosed. The method comprises of following steps. At first step, receive high current from a source by a plurality of entry press-fit terminals. Upon receiving, distribute equally the received high current from the plurality of entry press-fit terminals by an entry bus bar, where the plurality of entry press fit terminals are press fitted directly onto the PCB or onto the entry bus bar. After distributing, pass or interrupt the flow of equally distributed high current received from the entry bus bar by a plurality of switch elements. Further, distribute equally the high current passed from the plurality of switch elements by an exit bus bar. And finally, transmit the equally distributed high current received from the exit bus bar to a load by a plurality of exit press-fit terminals, where the plurality of exit press fit terminals are press fitted directly onto the PCB or onto the exit bus bar.

[0016] The foregoing has outlined, in general, the various aspects of the invention and serves as an aid to better understanding the more complete detailed description which is to follow. In reference to such, there is to be a clear understanding that the present invention is not limited to the method or application of use described and illustrated herein. It is intended that any other advantages and objects of the present invention that become apparent or obvious from the detailed description or illustrations contained herein are within the scope of the present invention.

BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS

[0017] The disclosure will be described and explained with additional specificity and detail with the accompanying figures in which:

[0018] FIGURE 1 is a block diagram illustrating system for carrying high current in an electronic printed circuit board according to an embodiment of the present invention. [0019] FIGURE 2 is a cross-sectional view of the electronic printed circuit board according to an embodiment of the present invention.

[0020] FIGURE 3 is a flow diagram illustrating method for carrying high current in an electronic printed circuit board according to an embodiment of the present invention.

[0021] Further, those skilled in the art will appreciate that elements in the figures are illustrated for simplicity and may not have necessarily been drawn to scale. Furthermore, in terms of the construction of the device, one or more components of the device may have been represented in the figures by conventional symbols, and the figures may show only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the figures with details that will be readily apparent to those skilled in the art having the benefit of the description herein.

DETAILED DESCRIPTION OF THE INVENTION

[0022] For the purposes of promoting an understanding of the principles of the invention, reference will now be made to the embodiment illustrated in the figures and specific language will be used to describe them. It will nevertheless be understood that no limitation of the scope of the invention is thereby intended. Such alterations and further modifications in the illustrated system, and such further applications of the principles of the invention as would normally occur to those skilled in the art are to be construed as being within the scope of the present invention.

[0023] It will be understood by those skilled in the art that the foregoing general description and the following detailed description are exemplary and explanatory of the invention and are not intended to be restrictive thereof. [0024] The terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process or method that comprises a list of steps does not include only those steps but may include other steps not expressly listed or inherent to such a process or method. Similarly, one or more devices or sub-systems or elements or structures or components preceded by "comprises... a" does not, without more constraints, preclude the existence of other devices, sub-systems, elements, structures, components, members, additional devices, additional sub-systems, additional elements, additional structures or additional components. Appearances of the phrase "in an embodiment", "in another embodiment" and similar language throughout this specification may, but not necessarily do, all refer to the same embodiment.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the art to which this invention belongs. The system, methods, and examples provided herein are only illustrative and not intended to be limiting.

[0026] Embodiments of the present invention will be described below in detail with reference to the accompanying figures.

[0027] FIGURE 1 shows a block diagram illustrating system for carrying high current in an electronic printed circuit board as per the current invention. The present invention discloses a system for passing high current through a printed circuit board (PCB) (10). The two main enablers for the present disclosure are press fit terminals (102, 106) and bus bars (103, 105). The press fit terminals (102, 106) and bus bars (103, 105) have an unique arrangement that helps to carry high current of above 400 A. The bus bars (103, 105) are soldered onto the PCB (10) whereas, the press fit terminals (102, 106) are not soldered but pressed fit onto the PCB (10). These press fit terminals (102, 106) do not use any additional material for the interconnection thus providing less resistivity and high conductivity. The bus bars (103, 105) are placed parallely on the PCB (10) and the press fit terminals (102, 106) are press fitted directly onto the PCB (10) or onto the bus bars (103, 105). The entry press fit terminals (102) and the entry bus bar (103) on the PCB (10) receive high current from the source (101) whereas the exit press fit terminals (106) and the exit bus bar (105) on the PCB (10) transfer the received high current to the load (107). The bus bars (103, 105) may be a copper sheet. The source (101) may be such as but not limited to battery pack, generator, solar panel array and the load (107) may be such as but not limited to motor, invertors. The switch elements (104) are placed in between the parallelly placed bus bars (103, 105). The switch elements (104) may be MOSFETS/FETS, semiconductor switches, mechanical switches or electro-mechanical switches which pass and interrupt the current flow passing through them.

[0028] According to an embodiment of the invention, the high current from the source (101) is provided as an input to the entry press fit terminals (102). The entry press fit terminals (102) interface the source (101) to the PCB (10) for passing of high current. The entry press fit terminals (102) further transfer the received high current to the inner layers of the PCB (10). The entry bus bar (103) receives the high current transferred by the entry press fit terminals (102) and distributes the high current to dissipate heat for thermal management. The switch elements (104) are configured to pass or interrupt the flow of distributed high current that is received from the entry bus bar (103). The exit bus bar (105) further distributes the high current passed from the switch elements (104). The exit press fit terminals (106) receive the distributed high current from the exit bus bar (105), wherein the received high current is transferred to the load (107).

[0029] FIGURE 2 shows a cross-sectional view of the electronic printed circuit board as per the current invention. According to an embodiment of the invention, the cross- sectional view shows the layers of the PCB (10) which are copper layer and dielectric layer placed alternatively. The entry press fit terminals (102), the entry bus bar (103), the switch elements (104), the exit bus bar (105) and the exit press fit terminals (106) are shown accordingly. The through holes (108) present on the PCB (10) ensure that the high current flows evenly throughout the PCB (10).

[0030] FIGURE 3 shows a flow diagram illustrating method for carrying high current in an electronic printed circuit board as per the current invention. According to an embodiment of the invention, the entry press-fit terminals (102) receive high current from a source (101). The entry bus bar (103) distributes the received high current from the entry press-fit terminals (102). The switch elements (104) pass or interrupt the flow of distributed high current received from the entry bus bar (103). The exit bus bar (105) distributes further the high current passed from the switch elements (104). The exit press-fit terminals (106) transfer the distributed high current received from the exit bus bar (105) to a load (107).

[0031] As per first embodiment of the current invention, the system comprises of a first link-element for connecting the plurality of entry press-fit terminals (102).

[0032] As per second embodiment of the current invention, the system comprises of a second link-element for connecting the plurality of exit press-fit terminals (106).

[0033] As per third embodiment of the current invention, the system comprises of the entry bus bar (103) and the exit bus bar (105) which may be made of copper, aluminium, electrically conductive materials.

[0034] As per fourth embodiment of the current invention, the system comprises of the first link-element and the second link-element which may be made of copper, aluminium, electrically conductive materials. [0035] As per fifth embodiment of the current invention, the system comprises of the plurality of switch elements (104) which may be semiconductor switches, mechanical switches or electro-mechanical switches.

[0036] According to an embodiment of the invention, a method for passing high current through a printed circuit board (PCB) (10) is disclosed. The method comprises the following steps. At first step, receive high current from a source (101) by a plurality of entry press-fit terminals (102). Upon receiving, distribute equally the received high current from the plurality of entry press-fit terminals (102) by an entry bus bar (103), where the plurality of entry press fit terminals (102) are press fitted directly onto the PCB (10) or onto the entry bus bar (103). After distributing, pass or interrupt the flow of equally distributed high current received from the entry bus bar (103) by a plurality of switch elements (104). Further, distribute equally the high current passed from the plurality of switch elements (104) by an exit bus bar (105). And finally, transmit the equally distributed high current received from the exit bus bar (105) to a load (107) by a plurality of exit press-fit terminals (106), where the plurality of exit press fit terminals (106) are press fitted directly onto the PCB (10) or onto the exit bus bar (105).

FURTHER ADVANTAGES OF THE INVENTION

[0037] So, the current invention prevents burning of the circuit when high current is provided as an input through the PCB. The same is achieved by providing copper bus bars that are soldered onto the PCB and the press fit terminals are press fitted directly onto the PCB or onto the bus bars.

[0038] The current invention further prevents occupying more space on the PCB and prevents higher cost by avoiding increase in copper thickness of the PCB. [0039] The current invention provides less resistivity and high conductivity with the proposed solution. The proposed solution avoids soldering in order to provide the interface for entry and exit of high current through the PCB. [0040] While specific language has been used to describe the invention, any limitations arising on account of the same are not intended. As would be apparent to a person skilled in the art, various working modifications may be made to the method in order to implement the inventive concept as taught herein. [0041] The figures and the foregoing description give examples of embodiments.

Those skilled in the art will appreciate that one or more of the described elements may well be combined into a single functional element. Alternatively, certain elements may be split into multiple functional elements. Elements from one embodiment may be added to another embodiment. Also, those acts that are not dependent on other acts may be performed in parallel with the other acts. The scope of embodiments is by no means limited by these specific examples.

REFERENCES