Title:
UNSATURATED GROUP-CONTAINING PHOSPHORIC ACID ESTER, THERMOSETTING RESIN COMPOSITION CONTAINING SAME, AND RESIN MATERIAL
Document Type and Number:
WIPO Patent Application WO/2022/085221
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a highly heat-resistant thermosetting resin composition able to be used in a high frequency printed circuit board. Provided is a phosphoric acid ester compound having an ethylenically unsaturated bond. This compound can be added as a modifier to a thermosetting resin such as an ethylenically unsaturated bond-containing poly(phenylene ether) resin. Also provided is a thermosetting resin composition that contains this modifier and a thermosetting resin. This thermosetting resin composition has the advantage of exhibiting high heat resistance. Furthermore, it is possible to achieve excellent dielectric properties and high heat resistance, which are required of printed circuit boards for next generation communication standards.
Inventors:
MOCHIZUKI YUSAKU (JP)
Application Number:
PCT/JP2021/014219
Publication Date:
April 28, 2022
Filing Date:
April 01, 2021
Export Citation:
Assignee:
DAIHACHI CHEM IND (JP)
International Classes:
C08F30/02; C07F9/09; C08F290/00; C08K5/523; C08L101/00; H05K1/03
Foreign References:
| JP2010105956A | 2010-05-13 | |||
| JP2003221415A | 2003-08-05 |
Other References:
KUMPULAINEN H, ET AL.: "An Efficient Strategy for the Synthesis of 1-Chloroethyl Phosphates and Phosphoramidates", THE JOURNAL OF ORGANIC CHEMISTRY, AMERICAN CHEMICAL SOCIETY, vol. 70, 27 September 2005 (2005-09-27), pages 9056 - 9058, XP003003168, ISSN: 0022-3263, DOI: 10.1021/jo0513562
"Homopolymers and copolymers of 0, 0- bis(methacryloyloxy-ethyl) phosphonates and phosphates", PLASTICHESKIE MASSY, vol. 6, 1967, pages 31 - 34
"Homopolymers and copolymers of 0, 0- bis(methacryloyloxy-ethyl) phosphonates and phosphates", PLASTICHESKIE MASSY, vol. 6, 1967, pages 31 - 34
Attorney, Agent or Firm:
YAMAMOTO, Shusaku et al. (JP)
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