Title:
UNSTRETCHED FILM, MULTILAYER BODY AND PACKAGE
Document Type and Number:
WIPO Patent Application WO/2023/145761
Kind Code:
A1
Abstract:
The present invention relates to an unstretched film, a multilayer body and a package; and the unstretched film comprises a base material layer and a sealant layer which is formed of a resin composition that contains 30 to 90% by mass of a propylene polymer (A) and 10 to 70% by mass of a 1-butene∙α-olefin copolymer (B). The propylene polymer (A) contains 50 to 90% by mole of a constituent unit that is derived from propylene and has a melting point (Tm) of 120°C to 135°C as determined by differential scanning calorimetry (DSC). The copolymer (B) contains 50 to 99% by mole of a constituent unit that is derived from 1-butene and 1 to 50% by mole of a constituent unit that is derived from α-olefin (provided that the sum of the constituent unit derived from 1-butene and the constituent unit derived from α-olefin is 100% by mole), and has a melting point of less than 120°C or no measurable melting point as determined by DSC. The sealant layer has a thickness of 3 to 30 µm; and the base material layer has a thickness of 10 to 100 µm.
Inventors:
MIZUMA TAKAHIRO (JP)
SHIOZAKI NAO (JP)
KAMIYA NOZOMI (JP)
EGAWA MAKOTO (JP)
KAI YUKI (JP)
HOYA HIROSHI (JP)
SHIOZAKI NAO (JP)
KAMIYA NOZOMI (JP)
EGAWA MAKOTO (JP)
KAI YUKI (JP)
HOYA HIROSHI (JP)
Application Number:
PCT/JP2023/002199
Publication Date:
August 03, 2023
Filing Date:
January 25, 2023
Export Citation:
Assignee:
MITSUI CHEMICALS INC (JP)
International Classes:
B32B27/32; B65D65/40; C08L23/00
Domestic Patent References:
| WO2021014966A1 | 2021-01-28 |
Foreign References:
| JP2017002315A | 2017-01-05 | |||
| JP2020192695A | 2020-12-03 | |||
| JPH11221884A | 1999-08-17 | |||
| JP2021063162A | 2021-04-22 | |||
| JP2020192696A | 2020-12-03 |
Attorney, Agent or Firm:
SSINPAT PATENT FIRM (JP)
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