Title:
UPPER LAYER FILM FORMING COMPOSITION, PATTERN FORMING METHOD, RESIST PATTERN, AND ELECTRONIC DEVICE MANUFACTURING METHOD
Document Type and Number:
WIPO Patent Application WO/2016/157988
Kind Code:
A1
Abstract:
This upper layer film forming composition forms an upper layer film by being coated on a resist film which is formed using actinic ray-sensitive or radiation-sensitive resin composition, and contains a resin X and a compound A having a radical trapping group. This pattern forming method involves a step a for forming a resist film by coating an actinic ray-sensitive or radiation-sensitive resin composition onto a substrate, a step b for forming an upper layer film on the resist film by a coating the resist film with the aforementioned upper layer film forming composition, a step c for exposing the resist film on which the upper layer film was formed, and a step d for forming a pattern by developing the exposed resist film using a developing solution that contains an organic solvent.
Inventors:
HATAKEYAMA NAOYA (JP)
INOUE NAOKI (JP)
TANGO NAOHIRO (JP)
SHIRAKAWA MICHIHIRO (JP)
GOTO AKIYOSHI (JP)
INOUE NAOKI (JP)
TANGO NAOHIRO (JP)
SHIRAKAWA MICHIHIRO (JP)
GOTO AKIYOSHI (JP)
Application Number:
PCT/JP2016/052985
Publication Date:
October 06, 2016
Filing Date:
February 02, 2016
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/11; C08F20/36; C08F26/02; C08K5/32; C08L33/10; C08L33/16; C08L101/00; G03F7/32; H01L21/027
Domestic Patent References:
| WO2014045783A1 | 2014-03-27 |
Foreign References:
| JPH07140668A | 1995-06-02 | |||
| JP2009229773A | 2009-10-08 | |||
| JP2014012815A | 2014-01-23 | |||
| JP2012088387A | 2012-05-10 | |||
| JP2005266817A | 2005-09-29 | |||
| JP2003233172A | 2003-08-22 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
Junko Nakajima (JP)
Junko Nakajima (JP)
Download PDF:
Previous Patent: FILM FOR TRANSPARENT CONDUCTIVE LAYER LAMINATION, METHOD FOR MANUFACTURING SAME, AND TRANSPARENT CON...
Next Patent: CONTROL CENTER
Next Patent: CONTROL CENTER