Title:
UV-CURABLE RESIN COMPOSITIONS SUITABLE FOR REDISTRIBUTION LAYERS
Document Type and Number:
WIPO Patent Application WO/2021/154898
Kind Code:
A3
Abstract:
Hydrophobic, tough, photoimagable, functionalized polyimide formulations have been discovered that can be UV cured and developed in cyclopentanone. The present invention formulations can be used as passivation and redistribution layers with patterning provided by photolithograph, for the redistribution of I/O pads on fan-out RDL applications. The curable polyimide formulations reduce stress on thin wafers, when compared to conventional polyimide formulations, and provide low modulus, hydrophobic solder mask. These materials can serve as protective layers in any applications in which a thin, flexible, and hydrophobic polymer is required, that also has high tensile strength and high elongation at break.
Inventors:
MIZORI FARHAD (US)
Application Number:
PCT/US2021/015344
Publication Date:
September 23, 2021
Filing Date:
January 28, 2021
Export Citation:
Assignee:
DESIGNER MOLECULES INC (US)
International Classes:
H01L21/314; C08G73/10; H01L23/08
Domestic Patent References:
| WO2018237377A1 | 2018-12-27 |
Foreign References:
| US20080262191A1 | 2008-10-23 | |||
| US20180237668A1 | 2018-08-23 | |||
| US8816021B2 | 2014-08-26 |
Attorney, Agent or Firm:
BABIN, Jane (US)
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