VACUUM CHUCK, BEVELING/POLISHING DEVICE, AND SILICON WAFER BEVELING/POLISHING METHOD

WIPO Patent Application WO/2016/088444

A1

A vacuum chuck (11) equipped with a vacuum chuck stage (111) having a round vacuum surface (111A), and also equipped with a vacuum protection pad (112) provided on the vacuum surface (111A), the vacuum chuck (11) being characterized in that: a ring-shaped or arc-shaped concavity (111C) for delimiting a center region (111D) positioned on the center side and an outer-circumferential region (111E) positioned on the outer-circumferential side is formed in the vacuum surface (111A); a concavity (111F) having a radiating shape is formed in the center region (111D); the vacuum protection pad (112) has through-holes (112A) connected to the concavity (111F) having the radiating shape; and the vacuum protection pad (112) is joined to a section of the vacuum surface (111A) in the center region (111D) excluding the concavity (111F) having the radiating shape.

WO/1998/016347	SEMICONDUCTOR SUBSTRATE POLISHING PAD DRESSER, METHOD OF MANUFACTURING THE SAME, AND CHEMICOMECHANICAL POLISHING METHOD USING THE SAME DRESSER
JP2005103455	WASTE LIQUID TREATMENT MECHANISM AND SUBSTRATE TREATMENT APPARATUS USING IT
JP2002246358	WAFER-DETECTING DEVICE, CLEANING AND DRYING EQUIPMENT AND PLATING EQUIPMENT

TORII KANTAROU (JP)

PCT/JP2015/078219

June 09, 2016

October 05, 2015

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SUMCO CORP (JP)

H01L21/304; B24B9/00; B24B37/30

JP2007194612A	2007-08-02
JP2007142220A	2007-06-07
JP2008062329A	2008-03-21

KINOSHITA & ASSOCIATES (JP)
Bottom intellectual property office of patent business corporation Tatsuyuki (JP)

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