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Title:
VACUUM CHUCK
Document Type and Number:
WIPO Patent Application WO/2023/106859
Kind Code:
A1
Abstract:
One embodiment of the present invention provides a vacuum chuck for adhering and fixing an object using vacuum pressure, comprising: a base unit which includes an opening formed at the top end thereof, has an empty space provided therein, and has a vacuum hole communicating with the empty space; and a porous layer unit disposed on the upper end of the base unit and having a plurality of pores having at least two or more different sizes, wherein the plurality of pores are disposed in different regions partitioned according to the size.

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Inventors:
LEE SEUNG SOO (KR)
HONG KYUNG EUI (KR)
Application Number:
PCT/KR2022/019932
Publication Date:
June 15, 2023
Filing Date:
December 08, 2022
Export Citation:
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Assignee:
POROUS MEDIA TECH CO LTD (KR)
International Classes:
B65G47/91; B25J15/06
Foreign References:
JP2020021799A2020-02-06
JP2020078832A2020-05-28
KR20140117413A2014-10-07
JP2015136754A2015-07-30
JP2011258846A2011-12-22
Attorney, Agent or Firm:
JIDAM IP LAW FIRM (KR)
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