Title:
VACUUM PACKAGING METHOD OF LARGE POWER LED REDIATING LUMINESCENCE INTEGRATED DIODE AND LARGE POWER LED RADIATING LUMINESCENCE INTEGRATED DIODE USING THE PACKAGING METHOD
Document Type and Number:
WIPO Patent Application WO/2010/083758
Kind Code:
A1
Abstract:
A vacuum packaging method of large power LED radiating luminescence integrated diode includes: setting crystal step, soldering gold line step and covering glass lens step; fixing a LED chip on the mirror reflecting whole metal thermal support (1) by low temperature metal tin paste, and finishing all the steps in the oxygen-enriched condition. The availability effect of the method is silver glue setting crystal spared, thermal resistance settled. Phosphor spot gluing is spared, the phosphor is by coating technology, the phosphor coating on the glass lens surface and a lens (3) are formed integral, so the discord of the light attenuation and color temperature of the phosphor is solved as a result of high temperature of chip and distributing non-uniform. A large power LED radiating luminescence using the packaging method is provided.
Inventors:
LIU XUEFENG (CN)
Application Number:
PCT/CN2010/070278
Publication Date:
July 29, 2010
Filing Date:
January 20, 2010
Export Citation:
Assignee:
LIU XUEFENG (CN)
International Classes:
H01L33/00
Foreign References:
| CN1545148A | 2004-11-10 | |||
| CN101170152A | 2008-04-30 | |||
| JP2007208150A | 2007-08-16 | |||
| JP2002139733A | 2002-05-17 |
Attorney, Agent or Firm:
INTELLECPRO CHINA LIMITED (Patent Division11/F, Tower C, Five Buildings, 9 Chegongzhuang Dajie, Xicheng District, Beijing 4, CN)
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