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Patent Searching and Data


Title:
VACUUM PUMP USING PROFILE
Document Type and Number:
WIPO Patent Application WO/2018/056558
Kind Code:
A1
Abstract:
The present invention relates to a vacuum pump using a profile. The vacuum pump according to the present invention comprises: a hollow profile having a longitudinal mounting hole and a vacuum chamber formed adjacent to each other; an ejector pump arranged inside the mounting hole in the longitudinal direction; and end caps provided in both openings of the profile, respectively, so as to have a through-hole formed therein so as to correspond to the inflow opening or the discharge opening. Particularly, the first cap near the inflow opening is designed to have a passage through which the vacuum chamber and the mounting hole communicate with each other. The vacuum pump structure according to the present invention is considered to be a vacuum pump structure using at least a so-called "profile" best designed to make fabrication of the vacuum pump convenient and to improve vacuum characteristics.

Inventors:
CHO HO-YOUNG (KR)
Application Number:
PCT/KR2017/007006
Publication Date:
March 29, 2018
Filing Date:
July 03, 2017
Export Citation:
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Assignee:
VTEC CO LTD (KR)
International Classes:
F04F5/22; F04F5/14
Foreign References:
KR101351768B12014-01-16
KR101472503B12014-12-12
KR101251825B12013-04-09
KR20140000264A2014-01-02
KR101157542B12012-06-22
Other References:
See also references of EP 3517788A4
Attorney, Agent or Firm:
YIM, Hoon-Bim (KR)
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