Title:
VAPOR CHAMBER, MANUFACTURING METHOD FOR VAPOR CHAMBER, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/284315
Kind Code:
A1
Abstract:
A vapor chamber, a manufacturing method for a vapor chamber, and an electronic device. The vapor chamber comprises a first cover plate (100), a second cover plate (200), and a copper plate (300), wherein the first cover plate (100) comprises a first light metal layer (110) and a first copper layer (120) arranged at one side of the first light metal layer (110); the second cover plate (200) comprises a second light metal layer (210) and a second copper layer (220) arranged at one side of the second light metal layer (210); the copper plate (300) is located between the first copper layer (120) and the second copper layer (220), the copper plate (300) is provided with a hollow portion (310), the hollow portion (310) establishes communication between the first copper layer (120) and the second copper layer (220), and the hollow portion (310) is filled with a working medium.
Inventors:
DUAN ZHIWEI (CN)
XU QINGSONG (CN)
LIU FAN (CN)
XU QINGSONG (CN)
LIU FAN (CN)
Application Number:
PCT/CN2022/080749
Publication Date:
January 19, 2023
Filing Date:
March 14, 2022
Export Citation:
Assignee:
ZTE CORP (CN)
International Classes:
F28D15/04
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Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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