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Patent Searching and Data


Title:
VAPOR CHAMBER, MANUFACTURING METHOD FOR VAPOR CHAMBER, AND ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/284315
Kind Code:
A1
Abstract:
A vapor chamber, a manufacturing method for a vapor chamber, and an electronic device. The vapor chamber comprises a first cover plate (100), a second cover plate (200), and a copper plate (300), wherein the first cover plate (100) comprises a first light metal layer (110) and a first copper layer (120) arranged at one side of the first light metal layer (110); the second cover plate (200) comprises a second light metal layer (210) and a second copper layer (220) arranged at one side of the second light metal layer (210); the copper plate (300) is located between the first copper layer (120) and the second copper layer (220), the copper plate (300) is provided with a hollow portion (310), the hollow portion (310) establishes communication between the first copper layer (120) and the second copper layer (220), and the hollow portion (310) is filled with a working medium.

Inventors:
DUAN ZHIWEI (CN)
XU QINGSONG (CN)
LIU FAN (CN)
Application Number:
PCT/CN2022/080749
Publication Date:
January 19, 2023
Filing Date:
March 14, 2022
Export Citation:
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Assignee:
ZTE CORP (CN)
International Classes:
F28D15/04
Foreign References:
CN215114113U2021-12-10
CN215491239U2022-01-11
CN113543574A2021-10-22
CN215261347U2021-12-21
CN214407102U2021-10-15
CN213873937U2021-08-03
CN110530184A2019-12-03
CN211012604U2020-07-14
CN111010858A2020-04-14
CN112648870A2021-04-13
CN210892824U2020-06-30
CN212806679U2021-03-26
CN209894013U2020-01-03
CN212431875U2021-01-29
CN213657611U2021-07-09
US20060289999A12006-12-28
Attorney, Agent or Firm:
JIAQUAN IP LAW (CN)
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