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Title:
VAPOR CHAMBER AND METHOD FOR MANUFACTURING SAME
Document Type and Number:
WIPO Patent Application WO/2020/149223
Kind Code:
A1
Abstract:
The present invention provides a vapor chamber which efficiently carries out heat radiation of a heat-emitting electronic component mounted on a thin high-density electronic circuit board, and method for manufacturing said vapor chamber.　A vapor chamber is connected with an electronic component via a circuit board heat radiation path formed on an electronic circuit board and efficiently radiates heat. The circuit board heat radiation path is integral with the vapor chamber with no connection material interposed therebetween. Heat is radiated with even greater efficiency by roughening a depression part surface which configures an airtight space of the vapor chamber. A thin, heat radiation-efficient vapor chamber which can be produced efficiently and has reliable quality can be provided by using an etching stop layer.

Inventors:
KOMATSU NOBUO (JP)
Application Number:
PCT/JP2020/000587
Publication Date:
July 23, 2020
Filing Date:
January 10, 2020
Export Citation:
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Assignee:
KMT TECH RESEARCH INC (JP)
International Classes:
H01L23/427; F28D15/02; F28D15/04
Foreign References:
JP2007212028A2007-08-23
JP2004327481A2004-11-18
JP2014003331A2014-01-09
JP2006159797A2006-06-22
JP2018197631A2018-12-13
JP2003329379A2003-11-19
JP2006313038A2006-11-16
Attorney, Agent or Firm:
INTECT INTERNATIONAL PATENT OFFICE et al. (JP)
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