VAPOR CHAMBER AND PREPARATION METHOD THEREFOR, AND ELECTRONIC DEVICE

WIPO Patent Application WO/2023/020364

A1

Embodiments of the present application provide a vapor chamber and a preparation method therefor, and an electronic device, and relate to the technical field of heat dissipation for solving the problems of large weight of an existing copper alloy vapor chamber, complex preparation process of the vapor chamber, and high production cost. The vapor chamber comprises a first cover plate and a second cover plate opposite to each other, a first capillary structure, a working medium, a first functional layer, and a second functional layer. The first cover plate is sealedly connected to the second cover plate to form a sealed cavity. The first capillary structure is provided in the sealed cavity. The working medium is provided in the sealed cavity. The first functional layer is provided between the first cover plate and the working medium. The second functional layer is provided between the second cover plate and the working medium, wherein both the first cover plate and the second cover plate are not in contact with the working medium, the material density of the first cover plate and the second cover plate is less than the density of the copper alloy, and the working medium comprises water.

JP3515752	THERMAL CONTROL SYSTEM
JP2619984	[Title of Invention] Temperature Control Device
JP6307395	Heat dissipation sheet

LU YUFEI (CN)
HUANG BO (CN)
XU ZHIXIAO (CN)
XIAO YONGWANG (CN)
LI WANGYI (CN)
ZHA PENG (CN)

PCT/CN2022/111903

February 23, 2023

August 11, 2022

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HUAWEI TECH CO LTD (CN)

H05K7/20

CN107197612A	2017-09-22
CN103562667A	2014-02-05
CN212431876U	2021-01-29
CN109813171A	2019-05-28
US20190014688A1	2019-01-10

BEIJING ZBSD PATENT&TRADEMARK AGENT LTD. (CN)

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