Title:
VAPOR DEPOSITION MASK
Document Type and Number:
WIPO Patent Application WO/2023/190861
Kind Code:
A1
Abstract:
Provided is a vapor deposition mask in which thermal deformation is inhibited. An embodiment of the present invention is a vapor deposition mask 10. The vapor deposition mask 10 is provided with a resin layer 24 having a pattern of opening parts for forming a thin film pattern, by vapor deposition, on a substrate subject to vapor deposition. The resin layer 24 contains a polyamic acid-derived polyimide including structural units represented by formula (1). In formula (1), X1 represents at least one tetravalent organic acid selected from formulas (3) and (3'), Y1 represents an F-containing organic group or a group represented by formula (P), and n is a positive integer representing the number of structural units. In formula (3'), R10, R11, R12, and R13 independently represent a hydrogen atom or a C1-3 monovalent alkyl group. In formula (P), R represents Cl, a C1-3 alkyl group, or a phenyl group. In formula (P), m represents an integer of 0-4, and r represents an integer of 1-3.
Inventors:
OTSUKA YOSHIKAZU (JP)
YAMADA TOMOHISA (JP)
MAEDA DAISUKE (JP)
YAMADA TOMOHISA (JP)
MAEDA DAISUKE (JP)
Application Number:
PCT/JP2023/013165
Publication Date:
October 05, 2023
Filing Date:
March 30, 2023
Export Citation:
Assignee:
NISSAN CHEMICAL CORP (JP)
International Classes:
C23C14/04; H05B33/10; H10K50/00
Domestic Patent References:
| WO2019139167A1 | 2019-07-18 |
Foreign References:
| JP2018024932A | 2018-02-15 | |||
| JP2019011494A | 2019-01-24 | |||
| JP2018172737A | 2018-11-08 | |||
| JP2021103308A | 2021-07-15 |
Attorney, Agent or Firm:
ITOH, Atsushi et al. (JP)
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