Title:
VARIABLE DISTANCE STRUCTURE
Document Type and Number:
WIPO Patent Application WO/2023/245882
Kind Code:
A1
Abstract:
The present application discloses a variable distance structure. The variable distance structure comprises a variable distance power assembly, a variable distance transmission assembly, a telescopic assembly and a butt-jointing assembly; the variable distance power assembly is connected to the variable distance transmission assembly; the variable distance transmission assembly is connected to the telescopic assembly; the telescopic assembly is connected to the butt-jointing assembly; the variable distance power assembly controls the distance between a silicon wafer carried by a carrier plate device, and at least one of a special gas spray device and a heat source by means of the variable distance transmission assembly, the telescopic assembly and the butt-jointing assembly.
Inventors:
DAI JIA (CN)
ZHU HENAN (CN)
DONG XUEDI (CN)
LIN JIAJI (CN)
ZHU HENAN (CN)
DONG XUEDI (CN)
LIN JIAJI (CN)
Application Number:
PCT/CN2022/118598
Publication Date:
December 28, 2023
Filing Date:
September 14, 2022
Export Citation:
Assignee:
LAPLACE WUXI SEMICONDUCTOR TECH CO LTD (CN)
International Classes:
C23C14/22; C23C14/50
Foreign References:
| CN216435860U | 2022-05-03 | |||
| CN104549849A | 2015-04-29 | |||
| CN101748377A | 2010-06-23 | |||
| CN102194728A | 2011-09-21 | |||
| CN108475654A | 2018-08-31 | |||
| CN109715849A | 2019-05-03 | |||
| CN109790618A | 2019-05-21 | |||
| DE102020130209A1 | 2022-05-19 |
Attorney, Agent or Firm:
BEYOND ATTORNEYS AT LAW (CN)
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