Title:
VEHICLE-MOUNTED ELECTRICAL COMPONENT INTERNAL CIRCUIT UNIT
Document Type and Number:
WIPO Patent Application WO/2021/215209
Kind Code:
A1
Abstract:
Disclosed is a vehicle-mounted electrical component internal circuit unit having a novel structure that enables a reduction in the work man-hours for a vehicle-mounted electrical component, and enables a reduction in the size of the vehicle-mounted electrical component. A vehicle-mounted electrical component internal circuit unit 10 includes: an insulating holding body 28 for holding circuit members 38 and 40; a wire harness 34 equipped with a covered electrical wire 102, a circuit-side connection part 104 provided on one end of the covered electrical wire 102, a connector 106 provided on the other end of the covered electrical wire 102, and a grommet 108 through which the covered electrical wire 102 passes; a plate wall part 32 covering a case through-hole 180 provided in a case 152 of a vehicle-mounted electrical component 146; and a seal member 100 that is provided on a first surface 84, which is the surface of the plate wall part 32 attached to the case 152, and that contacts the peripheral edge of the case through-hole 180. The wire harness 34 is inserted through a grommet mounting hole 96 in the plate wall part 32, and the grommet 108 of the wire harness 34 is adhered to the grommet mounting hole 96, thereby sealing the grommet mounting hole 96.
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Inventors:
SHIMIZU HIROSHI (JP)
Application Number:
PCT/JP2021/013804
Publication Date:
October 28, 2021
Filing Date:
March 31, 2021
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H02G3/14; B60R16/02; H01R13/52; H01R13/74; H02G3/08; H02G3/16; H02G3/22; H05K5/04; H05K7/00; H05K7/20
Domestic Patent References:
| WO2012157331A1 | 2012-11-22 |
Foreign References:
| JP2019050681A | 2019-03-28 |
Attorney, Agent or Firm:
KASAI & NAKANE INTERNATIONAL PATENT FIRM et al. (JP)
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