Title:
VEHICLE-MOUNTED ELECTRONIC CONTROL DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/243038
Kind Code:
A1
Abstract:
The present invention improves heat dissipation performance. This vehicle-mounted electronic control device comprises a circuit board, a first cover, a second cover, and a heat-conductive member. The circuit board is mounted with an electronic component that generates heat and a connector component that transmits and receives signals. The first cover and the second cover are arranged on both sides of the circuit board in the thickness direction, and form a case that accommodates the circuit board. The heat-conductive member is interposed between the electronic component and the first cover. The first cover has a thick-walled portion that is formed thicker than the thickness of the other portions. The thick-walled portion has a heat-generating component facing portion where the heat of the electronic component is transferred through the heat-conductive member, and extends in a first direction toward one side of the first cover from the heat-generating component facing portion.
Inventors:
UENO KEIKO (JP)
KAWAI YOSHIO (JP)
KANEKO TATSUYA (JP)
AKIBA RYO (JP)
KAWAI YOSHIO (JP)
KANEKO TATSUYA (JP)
AKIBA RYO (JP)
Application Number:
PCT/JP2022/024132
Publication Date:
December 21, 2023
Filing Date:
June 16, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
H05K7/20
Domestic Patent References:
| WO2018101257A1 | 2018-06-07 |
Foreign References:
| JP2002271068A | 2002-09-20 | |||
| JP2020047843A | 2020-03-26 | |||
| JP2009246170A | 2009-10-22 | |||
| JP2018014378A | 2018-01-25 |
Attorney, Agent or Firm:
SHIN-YU INTERNATIONAL PATENT FIRM (JP)
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