Title:
VEHICLE-MOUNTED WIRING MODULE AND FLEXIBLE SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2022/044666
Kind Code:
A1
Abstract:
A vehicle-mounted wiring module 20 to be mounted to a plurality of power storage elements 11 having electrode terminals 12A, 12B. The vehicle-mounted wiring module 20 comprises a busbar 40 that connects to the electrode terminals 12A, 12B, and a flexible substrate 21 electrically connected to the busbar 40. The flexible substrate 21 comprises a folded structure 23 folded at folding portions 26, 27. The folded structure 23, in an expanded state before being folded at the folding portions 26, 27, includes projections 24A, 24B projecting from outer edges E1, E2 of the flexible substrate 21, and slits 25A, 25B for passing the projections 24A, 24B. In the expanded state, the folding portions 26, 27 are disposed between the projections 24A, 24B and the slits 25A, 25B of the flexible substrate 21. As the projections 24A, 24B are passed through the slits 25A, 25B, the flexible substrate 21 is prevented from being deformed to return from the state of being folded at the folding portions 26, 27 to the expanded state.
Inventors:
MATSUMURA NOBUYUKI (JP)
Application Number:
PCT/JP2021/027847
Publication Date:
March 03, 2022
Filing Date:
July 28, 2021
Export Citation:
Assignee:
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
SUMITOMO WIRING SYSTEMS (JP)
SUMITOMO ELECTRIC INDUSTRIES (JP)
International Classes:
H01G2/06; H01G4/38; H01M50/209; H01M50/249; H01M50/284; H01M50/298; H01M50/519; H05K1/02
Domestic Patent References:
| WO2009037796A1 | 2009-03-26 |
Foreign References:
| JP2011210711A | 2011-10-20 | |||
| JP2019021454A | 2019-02-07 | |||
| JP2001326427A | 2001-11-22 |
Attorney, Agent or Firm:
AKATSUKI UNION PATENT FIRM (JP)
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