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Patent Searching and Data


Title:
VERTICAL CRACK FORMING METHOD AND VERTICAL CRACK FORMING DEVICE IN SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2006/011608
Kind Code:
A1
Abstract:
A vertical crack forming method and a vertical crack forming device capable of forming a deep and straight vertical crack in a fragile substrate to obtain a good division plane by dividing. In the method for vertically cracking a fragile substrate by generating and growing a vertical crack along a predetermined vertical cracking line from a cut made in the fragile substrate by irradiating it with a laser beam along the predetermined vertical cracking line on the fragile substrate such that the fragile substrate is heated at a temperature not higher than its melting point, high temperature parts being subjected to strong irradiation with laser beam and low temperature parts being subjected to weak irradiation, as compared with that to the high temperature parts, with laser beam are formed alternately along the predetermined vertical cracking line.

Inventors:
YAMAMOTO KOJI (JP)
HASAKA NOBORU (JP)
Application Number:
PCT/JP2005/013980
Publication Date:
February 02, 2006
Filing Date:
July 29, 2005
Export Citation:
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Assignee:
MITSUBOSHI DIAMOND IND CO LTD (JP)
YAMAMOTO KOJI (JP)
HASAKA NOBORU (JP)
International Classes:
B23K26/00; B28D5/00; B23K26/066; B23K26/18; B23K26/38; B23K26/40; C03B33/09; G02F1/13; G02F1/1333
Foreign References:
JPH07328781A1995-12-19
JP2004155159A2004-06-03
JPS59193413A1984-11-02
JP2004223796A2004-08-12
Other References:
None
See also references of EP 1772245A4
Attorney, Agent or Firm:
Kashima, Yoshio (7-2 Minami Ogi-machi, Kita-k, Osaka-city Osaka, JP)
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