Title:
VIA STRUCTURE AND FABRICATING METHOD THEREFOR, ELECTRONIC DEVICE, AND DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/155893
Kind Code:
A1
Abstract:
A via structure and manufacturing method therefor, an electronic device, and a display device, relating to the technical field of electronics. The via structure comprises: a first conductive layer (10), an interlayer insulating layer (20), and a second conductive layer (30) arranged in sequence. The interlayer insulating layer (20) is provided with a via (201); the second conductive layer (30) is connected to the first conductive layer (10) by means of the via (201); and at least part of the surface of the interlayer insulating layer (20) in contact with the second conductive layer (30) is uneven, so that the part of the second conductive layer (30) located in the via hole (201) is prevented from falling off, thereby avoiding the poor connection between the second conductive layer (30) and the first conductive layer (10). The via structure is used for the connection of conductive layers.
Inventors:
ZHANG LEI (CN)
SUN DAQING (CN)
QIU WEI (CN)
YAN FANGLIANG (CN)
SUN DAQING (CN)
QIU WEI (CN)
YAN FANGLIANG (CN)
Application Number:
PCT/CN2019/125656
Publication Date:
August 06, 2020
Filing Date:
December 16, 2019
Export Citation:
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
MIANYANG BOE OPTOELECTRONICS TECH COLTD (CN)
MIANYANG BOE OPTOELECTRONICS TECH COLTD (CN)
International Classes:
H01L21/768
Foreign References:
| CN109801874A | 2019-05-24 | |||
| CN102573280A | 2012-07-11 | |||
| TW200834869A | 2008-08-16 | |||
| CN107887361A | 2018-04-06 | |||
| US20140292159A1 | 2014-10-02 | |||
| CN109003944A | 2018-12-14 |
Attorney, Agent or Firm:
BEIJING SAN GAO YONG XIN INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)
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