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Title:
VIAL PACKING METHOD, VIAL INSTALLATION METHOD, AND VIAL PACKED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2023/095390
Kind Code:
A1
Abstract:
For the purpose of providing a method for transporting a vial made from a thermoplastic resin in a sterilized state or in a state where no exogenous pyrogen is present, then introducing the vial into a filling assembly line and then placing the vial stationarily while preventing the falling down or dropping off of the vial and providing others, the method according to the present application is a method for vacuum-packaging a vial into which a content such as a medicine or cells is to be filled and packing the vial, the method including the following steps. (I) A step for inserting a plurality of vials 4 into a tray 3 in such a manner that the opening sides of the vials 4 face the bottom of the tray 3. (II) A step for placing a soft film 5 on the bottoms of the vials 4. (III) A step for charging the tray 3 on which the vials 4 have been placed and the soft film 5 into a bag made from a gas-impermeable flexible film. (IV) A step for reducing the pressure in the bag made from the flexible film to a predetermined vacuum pressure. (V) A step for sealing an opening of the bag made from the flexible film.

Inventors:
OGAWA SHUN (JP)
ARAKAWA SHOTA (JP)
Application Number:
PCT/JP2022/030376
Publication Date:
June 01, 2023
Filing Date:
August 09, 2022
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO (JP)
International Classes:
B65B31/02; A61J1/00; A61J1/05; B65B55/08
Domestic Patent References:
WO2017170636A12017-10-05
Foreign References:
JP5314892B22013-10-16
JP2006273400A2006-10-12
Attorney, Agent or Firm:
INABA, Yoshiyuki et al. (JP)
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