Title:
VIBRATION DEVICE, CONNECTING STRUCTURE, AND METHOD OF MANUFACTURING VIBRATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/100827
Kind Code:
A1
Abstract:
This vibration device comprises a vibration part and a connecting structure. The vibration part includes a piezoelectric element. The connecting structure includes a band-shaped wiring member and a lead wire. The wiring member is connected to the vibration part. The lead wire is connected to the wiring member. The lead wire includes a bundle of a plurality of core wires, and a covering member covering the bundle. The wiring member includes a resin layer and a conductor layer disposed on the resin layer. The bundle has a first end exposed from the covering member. The conductor layer includes a second end connected to the first end. The first end has a first surface opposing the second end. The second end is curved along the outer peripheral surfaces of the core wires on the first surface.
Inventors:
TAKI TATSUYA (JP)
OHTA YOSHIKI (JP)
TERADA TAKESHI (JP)
SASAKI RYUHEI (JP)
OHTA YOSHIKI (JP)
TERADA TAKESHI (JP)
SASAKI RYUHEI (JP)
Application Number:
PCT/JP2019/044186
Publication Date:
May 22, 2020
Filing Date:
November 11, 2019
Export Citation:
Assignee:
TDK CORP (JP)
International Classes:
H01L41/047; H01L41/083; H01L41/09; H01L41/187; H01L41/29
Foreign References:
| JP2017104203A | 2017-06-15 | |||
| JP2017092326A | 2017-05-25 | |||
| JP2011164003A | 2011-08-25 | |||
| JP2010105316A | 2010-05-13 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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