Title:
VIBRATION PLATE STRUCTURE, PREPARATION METHOD FOR VIBRATION PLATE STRUCTURE, LOUDSPEAKER AND ELECTRONIC TERMINAL
Document Type and Number:
WIPO Patent Application WO/2022/143208
Kind Code:
A1
Abstract:
Disclosed are a vibration plate structure, a preparation method for the vibration plate structure, a loudspeaker and an electronic terminal. The vibration plate structure comprises a body and a thermosetting adhesive film layer, and the adhesive film layer is hot-press compounded onto at least one surface of the body. The present invention aims to provide a vibration plate structure which does not increase the weight and thickness excessively. Without affecting the sensitivity and response of a product, the vibration plate structure effectively increases the bonding capacity and strength thereof while the thickness of the product remains essentially the same, and the continuous working capacity of the vibration plate structure in a highly humid environment is improved.
Inventors:
XU YANDONG (CN)
LIU YINGXIN (CN)
WANG JIANJIAN (CN)
WANG PENG (CN)
LIU YINGXIN (CN)
WANG JIANJIAN (CN)
WANG PENG (CN)
Application Number:
PCT/CN2021/138968
Publication Date:
July 07, 2022
Filing Date:
December 17, 2021
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R7/06
Foreign References:
| CN112770229A | 2021-05-07 | |||
| CN200969671Y | 2007-10-31 | |||
| CN106817663A | 2017-06-09 | |||
| US20040085001A1 | 2004-05-06 | |||
| US20050253298A1 | 2005-11-17 |
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