Title:
VIBRATION SENSOR, ELECTRONIC DEVICE, AND VIBRATION DETECTION METHOD
Document Type and Number:
WIPO Patent Application WO/2023/160719
Kind Code:
A1
Abstract:
A vibration sensor, an electronic device, and a vibration detection method. The vibration sensor comprises a circuit board assembly, a housing, a chip assembly, a vibration pickup assembly, and a through hole. A back cavity is formed in the circuit board assembly, the housing is fastened on the circuit board assembly, the chip assembly is disposed on the side of the circuit board assembly close to the housing, and is electrically connected to the circuit board assembly. The vibration pickup assembly is disposed in a cavity and divides the cavity into a first cavity and a second cavity. The through hole of the vibration sensor can communicate the back cavity and the second cavity.
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Inventors:
YAN TANGLIU (CN)
PEI ZHENWEI (CN)
BI XUNXUN (CN)
DUANMU LUYU (CN)
PEI ZHENWEI (CN)
BI XUNXUN (CN)
DUANMU LUYU (CN)
Application Number:
PCT/CN2023/078692
Publication Date:
August 31, 2023
Filing Date:
February 28, 2023
Export Citation:
Assignee:
GOERTEK MICROELECTRONICS INC (CN)
International Classes:
H04R3/00; H04R19/04
Foreign References:
| CN114630236A | 2022-06-14 | |||
| CN212572961U | 2021-02-19 | |||
| CN213694145U | 2021-07-13 | |||
| CN112333618A | 2021-02-05 | |||
| CN215187377U | 2021-12-14 | |||
| US20200037441A1 | 2020-01-30 |
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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