Title:
VINYL POLYMER POWDER, CURABLE RESIN COMPOSITION, AND CURED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2013/062123
Kind Code:
A1
Abstract:
The present invention provides: a vinyl polymer powder that comprises a vinyl polymer having a glass transition temperature of at least 120°C and a mass average molecular weight of at least 100,000, has superior dispersibility in a curable resin composition, rapidly causes the curable resin composition to be in a gel state by means of heating for a short period of time at a predetermined temperature, and can cause the further obtained cured product to have a low coefficient of linear expansion and favorable cracking resistance; a curable resin composition containing the vinyl polymer powder and a curable resin; and a cured product obtained by curing the curable resin composition.
Inventors:
HATAE YOUKO (JP)
KASAI TOSHIHIRO (JP)
KASAI TOSHIHIRO (JP)
Application Number:
PCT/JP2012/077835
Publication Date:
May 02, 2013
Filing Date:
October 29, 2012
Export Citation:
Assignee:
MITSUBISHI RAYON CO (JP)
International Classes:
C08F265/04; C08F20/00; C08F291/00; C08L33/04; C08L51/06; C08L63/00; H01L23/29; H01L23/31
Domestic Patent References:
| WO2010090246A1 | 2010-08-12 | |||
| WO2006051803A1 | 2006-05-18 |
Foreign References:
| JP2003049050A | 2003-02-21 | |||
| JP2010090371A | 2010-04-22 |
Attorney, Agent or Firm:
MIYAZAKI, Teruo et al. (JP)
Akio Miyazaki (JP)
Akio Miyazaki (JP)
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Claims: