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Title:
VISCOUS FLUID SUPPLIER, VISCOUS FLUID REPLENISHING DEVICE AND OPENING/CLOSING MEMBER
Document Type and Number:
WIPO Patent Application WO/2014/128827
Kind Code:
A1
Abstract:
In order to further simplify the structure of a solder replenishing device, this viscous fluid supplier (50) is configured to discharge and cut the viscous fluid by the deformation of an opening/closing member (52) as a result of changes in the pressure applied on the viscous fluid. Said opening/closing member (52) can be an elastic member that opens a discharge port (53) and discharges the viscous fluid when the viscous fluid is pressurized and cuts viscous fluid that has been discharged by closing the discharge port when pressurization is stopped. The opening/closing member (52) can be a plate-shaped body in which a slit section having multiple slits is formed, for example, one in which a slit section (54) with a form having multiple linear slits that intersect is formed. The slit section (54) can have a form in which three linear slits intersect at a single point at the center.

Inventors:
HIRUKAWA RITSUO (JP)
Application Number:
PCT/JP2013/053986
Publication Date:
August 28, 2014
Filing Date:
February 19, 2013
Export Citation:
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Assignee:
FUJI MACHINE MFG (JP)
International Classes:
B23K3/06; B41F15/40; F16K15/14; B65D35/52; B65D47/20
Foreign References:
JPS5717745A1982-01-29
JP2007062780A2007-03-15
JPH10157754A1998-06-16
JP2009226472A2009-10-08
JPS60181261U1985-12-02
JPH0238169U1990-03-14
JP2002316261A2002-10-29
JP2003025568A2003-01-29
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
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