Title:
WAFER BOAT AND SEMICONDUCTOR PROCESS APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/067187
Kind Code:
A1
Abstract:
Disclosed in the present invention are a wafer boat and a semiconductor process apparatus. The disclosed wafer boat comprises a support and a wafer bearing device, wherein the wafer bearing device comprises an edge bearing portion and an extension bearing portion, the edge bearing portion encloses an avoidance space having an opening, the extension bearing portion is connected to the edge bearing portion and extends toward the avoidance space, the edge bearing portion and the extension bearing portion are configured to jointly support a wafer, the edge bearing portion is configured to support the edge of the wafer, and the wafer bearing device is connected to the support. The described solution can solve the problem in the related art of a relatively large degree of warping of the wafer when the wafer boat carries the wafer for processing.
Inventors:
HUANG RONGBIAO (CN)
YANG HUIPING (CN)
YANG SHUAI (CN)
LI CEN (CN)
GUAN XIAOCHEN (CN)
YANG HUIPING (CN)
YANG SHUAI (CN)
LI CEN (CN)
GUAN XIAOCHEN (CN)
Application Number:
PCT/CN2023/119296
Publication Date:
April 04, 2024
Filing Date:
September 18, 2023
Export Citation:
Assignee:
BEIJING NAURA MICROELECTRONICS EQUIPMENT CO LTD (CN)
International Classes:
H01L21/673; H01L21/67; H01L21/677
Attorney, Agent or Firm:
TEE & HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
Download PDF: