Title:
WAFER CLEANING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/035546
Kind Code:
A1
Abstract:
The present invention provides a wafer cleaning method and a method for manufacturing a semiconductor device. The wafer cleaning method comprises: carrying out protonation treatment on a cleaning solution by using a protonation processor; cleaning the surface of a wafer with the protonated cleaning solution, such that the amount of negative charges carried on the surface of the cleaned wafer is smaller than the amount of negative charges carried on the surface of the wafer cleaned with a cleaning solution that is not subjected to protonation treatment, the surface of the cleaned wafer being covered with a liquid film of the cleaning solution; and purging the surface of the wafer by using dry gas, to remove the liquid film from the center to the edge of the surface of the wafer. According to the technical solution of the present invention, static electricity on the surface of the wafer can be well restrained, device failure caused by the static electricity is effectively reduced, and then the overall yield of integrated circuit machining is improved.
Inventors:
HAN RUIJING (CN)
ZENG HUI (CN)
ZENG HUI (CN)
Application Number:
PCT/CN2022/074721
Publication Date:
March 16, 2023
Filing Date:
January 28, 2022
Export Citation:
Assignee:
GUANGZHOU CANSEMI TECH INC (CN)
International Classes:
H01L21/02
Foreign References:
| CN1092477A | 1994-09-21 | |||
| CN106186216A | 2016-12-07 | |||
| TW296457B | 1997-01-21 | |||
| CN113506726A | 2021-10-15 | |||
| JP2001156034A | 2001-06-08 | |||
| US20140261537A1 | 2014-09-18 | |||
| JP2010123858A | 2010-06-03 | |||
| CN112992657A | 2021-06-18 | |||
| CN1249361A | 2000-04-05 |
Attorney, Agent or Firm:
SHANGHAI SAVVY IP AGENCY CO., LTD. (CN)
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