Title:
WAFER CONVEYING METHOD AND WAFER CONVEYING DEVICE
Document Type and Number:
WIPO Patent Application WO/2011/010683
Kind Code:
A1
Abstract:
A wafer conveying method is provided with: a step which, in order to produce a gap between any adjacent wafers (90) among wafers (90) stacked on one another in liquid, discharges the liquid toward the end surfaces of the wafers (90); and a step which picks up at least the uppermost-located wafer (90) among the wafers (90) with the gap produced. The configuration enables the wafers (90) to be separated one by one without using manpower after cutting, for example, by wire saws.
Inventors:
MIYAI HIROTAKA (JP)
YAMAMOTO SHIGEO (JP)
SEKIME HIROSHIGE (JP)
TOMITA KOUICHI (JP)
HARA MASATAKA (JP)
YAMAMOTO SHIGEO (JP)
SEKIME HIROSHIGE (JP)
TOMITA KOUICHI (JP)
HARA MASATAKA (JP)
Application Number:
PCT/JP2010/062303
Publication Date:
January 27, 2011
Filing Date:
July 22, 2010
Export Citation:
Assignee:
SUMITOMO METAL FINE TECHNOLOGY CO LTD (JP)
MIYAI HIROTAKA (JP)
YAMAMOTO SHIGEO (JP)
SEKIME HIROSHIGE (JP)
TOMITA KOUICHI (JP)
HARA MASATAKA (JP)
MIYAI HIROTAKA (JP)
YAMAMOTO SHIGEO (JP)
SEKIME HIROSHIGE (JP)
TOMITA KOUICHI (JP)
HARA MASATAKA (JP)
International Classes:
H01L21/677
Domestic Patent References:
| WO2008068943A1 | 2008-06-12 |
Foreign References:
| JP2003292160A | 2003-10-15 |
Attorney, Agent or Firm:
YOSHIDA Minoru et al. (JP)
Yoshida 稔 (JP)
Yoshida 稔 (JP)
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