WAFER DELIVERY DEVICE, WAFER STORAGE CONTAINER, AND WAFER STORAGE SYSTEM

Title:

WAFER DELIVERY DEVICE, WAFER STORAGE CONTAINER, AND WAFER STORAGE SYSTEM

Document Type and Number:

WIPO Patent Application WO/2021/044791

Kind Code:

A1

Abstract:

In this wafer storage container, a first ring part including a first supported part, which is formed in a first position when viewed in a plan view, and a second ring part including a second supported part, which is formed in a second position when viewed in a plan view, are alternately superposed in the vertical direction. This wafer delivery device comprises first and second ring support parts, a raising/lowering part, and a delivery part. The first ring support part has: a first support piece the vertical position of which is fixed; and a first driving mechanism that drives the first support piece. The first driving mechanism selectively establishes any one among a first state in which the first support piece is superposed on the first position when viewed in a plan view, a second state in which the first support piece is superposed on the second position when viewed in a plan view, and a third state in which the first support piece is not superposed on the first and second positions when viewed in a plan view.

Inventors:

TORAZAWA MASAYOSHI (JP)
NAKAMURA YOICHI (JP)

Application Number:

PCT/JP2020/029897

Publication Date:

March 11, 2021

Filing Date:

August 04, 2020

Export Citation:

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Assignee:

MURATA MACHINERY LTD (JP)

International Classes:

H01L21/673

Domestic Patent References:

WO2014107818A2

2014-07-17

Foreign References:

JP2009500256A	2009-01-08
US20190074203A1	2019-03-07
US20180122674A1	2018-05-03
JP2005311038A	2005-11-04
JP2007197214A	2007-08-09
JP2009029604A	2009-02-12
JP2005142443A	2005-06-02
JP4751827B2	2011-08-17
JP4751827B2	2011-08-17

Other References: