Title:
WAFER DICING METHOD, MOUNTING METHOD, METHOD FOR MANUFACTURING ADHESIVE LAYER, AND MOUNTED BODY
Document Type and Number:
WIPO Patent Application WO/2012/121307
Kind Code:
A1
Abstract:
The visibility of wafer cutting lines is assured and an adhesive layer is easily attached to each chip. Provided are: a mounting step for mounting a wafer (20) on a dicing sheet (21); a dicing step for dicing the wafer (20) into a plurality of chips (30); an adhesive forming step for forming an adhesive layer (31) on the surface of the wafer (20) after the dicing step; and an expanding step that separates the wafer (20) with the adhesive layer (31) into the individual chips by expanding the dicing sheet (21) on which the wafer (20) is mounted.
Inventors:
KOJIMA RYOJI (JP)
Application Number:
PCT/JP2012/055881
Publication Date:
September 13, 2012
Filing Date:
March 07, 2012
Export Citation:
Assignee:
SONY CHEM & INF DEVICE CORP (JP)
KOJIMA RYOJI (JP)
KOJIMA RYOJI (JP)
International Classes:
H01L21/52; H01L21/301; H01L21/60
Foreign References:
| JP2008098253A | 2008-04-24 | |||
| JP2005116957A | 2005-04-28 | |||
| JP2005223285A | 2005-08-18 | |||
| JP2006049591A | 2006-02-16 | |||
| JP2011119767A | 2011-06-16 |
Attorney, Agent or Firm:
KOIKE, Akira et al. (JP)
Akira Koike (JP)
Akira Koike (JP)
Download PDF:
Claims:
Previous Patent: TIRE AND WHEEL ASSEMBLY
Next Patent: MAGNETIC FORCE MICROSCOPE AND HIGH SPATIAL RESOLUTION MAGNETIC FIELD MEASURING METHOD
Next Patent: MAGNETIC FORCE MICROSCOPE AND HIGH SPATIAL RESOLUTION MAGNETIC FIELD MEASURING METHOD