Title:
WAFER HOLDING STAGE AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2016/035878
Kind Code:
A1
Abstract:
This wafer holding stage 10 is provided with an adhesive layer 16, which is formed of a resin, between an electrostatic chuck 12, which is formed of a ceramic, and a cooling plate 14, which is formed of a metal. The adhesive layer 16 comprises a first layer 16a that is in contact with the electrostatic chuck 12, a second layer 16b that is in contact with the cooling plate 14, and an intermediate layer 16c that is positioned between the first layer 16a and the second layer 16b. The first layer 16a and the intermediate layer 16c have higher heat resistance than the second layer 16b, and the second layer 16b has higher flexibility than the first layer 16a and the intermediate layer 16c. These layers are in airtight contact with each other.
Inventors:
YANOH TAKUYA (JP)
OHBA KAZUMA (JP)
KAWAJIRI TETSUYA (JP)
TSURUTA HIDEYOSHI (JP)
OHBA KAZUMA (JP)
KAWAJIRI TETSUYA (JP)
TSURUTA HIDEYOSHI (JP)
Application Number:
PCT/JP2015/075178
Publication Date:
March 10, 2016
Filing Date:
September 04, 2015
Export Citation:
Assignee:
NGK INSULATORS LTD (JP)
International Classes:
H01L21/683; C04B37/02
Foreign References:
| JP2012129539A | 2012-07-05 | |||
| JP2009071023A | 2009-04-02 | |||
| JP2013120835A | 2013-06-17 | |||
| JP2014183077A | 2014-09-29 |
Attorney, Agent or Firm:
ITEC INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Itec international patent firm (JP)
Patent business corporation Itec international patent firm (JP)
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